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  3. Test Sockets
  4. Test socket burn-in test for IC devices (Japan Connect Industry Co., Ltd.)
Test socket burn-in test for IC devices-GU15 frame series
Test socket burn-in test for IC devices-GU22 mold frame series
Test socket burn-in test for IC devices-GQ29-BGA mold frame series
Test socket burn-in test for IC devices-GU37 mold frame series
Test socket burn-in test for IC devices-GU41 series (1mm pitch)
Test socket burn-in test for IC devices-GQ frame series
Test socket burn-in test for IC devices-GU78-BGA series
Test socket burn-in test for IC devices-Japan Connect Industry Co., Ltd.

Test socket burn-in test for IC devices
Japan Connect Industry Co., Ltd.

Japan Connect Industry Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

117.8hours

About This Product

This is an IC socket used in the back-end process of semiconductor production. You can verify semiconductor devices and circuits using mass-production boards. Leave the custom design and manufacturing of test sockets to Nippon Connect Kogyo. We have a track record of developing numerous custom products, including special specifications. If you provide us with the following information, we will suggest the most suitable product.

■Information

・Dimensions of the device (including tolerance information and confirmation of lead shape) ・Restrictions such as the height of the device receiving surface ・Limitations on board area ・Shape compatible with sensor ・Durability ・Temperature (for burn-in test), humidity ・Used signal frequency, etc. *Other model numbers are available.

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    Test socket burn-in test for IC devices

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Last viewed: 49 minutes ago

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10 Models of Test socket burn-in test for IC devices

Click on the part number for more information about each product

Image Part Number Price (excluding tax) Compatible device
Test socket burn-in test for IC devices-Part Number-GU15 frame series

GU15 frame series

Available upon quote

SOP, SON,
SOJ, SIP, LGA etc.

Test socket burn-in test for IC devices-Part Number-GU22 mold frame series

GU22 mold frame series

Available upon quote

BGA (WLCSP), QFN, LGA

Test socket burn-in test for IC devices-Part Number-GU22 series high heat resistant type

GU22 series high heat resistant type

Available upon quote

BGA (WLCSP), QFN, LGA

Test socket burn-in test for IC devices-Part Number-GQ29-BGA mold frame series

GQ29-BGA mold frame series

Available upon quote

BGA

Test socket burn-in test for IC devices-Part Number-GU37 mold frame series

GU37 mold frame series

Available upon quote

0.30mm pitch or larger

Test socket burn-in test for IC devices-Part Number-GU41 series (1mm pitch)

GU41 series (1mm pitch)

Available upon quote

FTGB196, 256-Pin FBGA, FT256/FTG256, FG256/FGG256, FG320/FGG320, 324-Pin FBGA

Test socket burn-in test for IC devices-Part Number-GU41 series (0.8mm pitch)

GU41 series (0.8mm pitch)

Available upon quote

169-Pin UBGA, CS144/CSG144, 256-Pin UBGA, CS324/CSG324, CS280/CSG280, SF363/SFG363, 484-Pin UBGA, etc.

Test socket burn-in test for IC devices-Part Number-GQ frame series

GQ frame series

Available upon quote

SOP, L.G.A.

Test socket burn-in test for IC devices-Part Number-GU78-BGA series

GU78-BGA series

Available upon quote

BGA

Test socket burn-in test for IC devices-Part Number-GGI series

GGI series

Available upon quote

BGA, LGA, QFN, QFP, etc.

Click on the part number for more information about each product

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About Company Handling This Product

Japan Connect Industry Co., Ltd.

Response Rate

100.0%

Response Time

117.8hrs

  • Japan

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Test Sockets
Test Sockets　Japan Connect Industry Co., Ltd.
Japan Connect Industry Co., Ltd.

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