Test socket final test for IC devices
Japan Connect Industry Co., Ltd.
About This Product
This is an IC socket used in the back-end process of semiconductor production. You can verify semiconductor devices and circuits using mass-production boards.
Leave the custom design and manufacturing of test sockets to Nippon Connect Kogyo. We have a track record of developing numerous custom products, including special specifications. If you provide us with the following information, we will suggest the most suitable product.
■Information
・Dimensions of the device (including tolerance information and confirmation of lead shape)
・Restrictions such as the height of the device receiving surface
・Limitations on board area
・Shape compatible with sensor
・Durability
・Temperature (for burn-in test), humidity
・Used signal frequency, etc.
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Product
Test socket final test for IC devices
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Handling Company
Japan Connect Industry Co., Ltd.
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Categories
5 Models of Test socket final test for IC devices
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | Compatible device type | Contact resistance | Operating temperature range | Rated current |
|---|---|---|---|---|---|---|
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Open type full custom socket |
Available upon quote | - | - | - | - |
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LGAxxx-IMXS-P100-xx |
Available upon quote | LGA, (BGA, QFN) | 200mΩmax | -35℃~+150℃ | 1A max |
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PGAxxxA-CMVS-Pxxx-xxx |
Available upon quote | PGA | 15mΩmax | -35℃~+150℃ | 1A max |
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MPGAP-10P-xxxx-xxx |
Available upon quote | - | - | - | - |
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Full custom image sensor socket |
Available upon quote | - | - | - | - |
Click on the part number for more information about each product
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