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  2. Tabletop manual cleavage device PELCO® LatticeAx® (HiSOL,Inc.)
Tabletop manual cleavage device PELCO® LatticeAx®-PELCO® LatticeAx®
Tabletop manual cleavage device PELCO® LatticeAx®-HiSOL,Inc.

Tabletop manual cleavage device PELCO® LatticeAx®
HiSOL,Inc.

About This Product

Ted Pella (USA) is a cleavage equipment manufacturer that achieves the world's highest level of high-precision cleavage using manual equipment. A single device can perform everything from microindentation (shallow cuts) to cleavage, and the accuracy is within ±10um (patent pending). In recent years, it has attracted attention as a pre-processing application for cross-sectional observation of TSVs and bumps, and can be used as a pre-processing tool that can produce a cross-section that can be directly SEM observed in just 5 minutes, and significantly shorten the processing time for FIB etc. is also used. There is no scribing, so there is no loss of the target area. This is completely different from the simple cleavage devices used up until now. Using the PELCO®️ LatticeAx®️ manual cleavage device will revolutionize the cross-sectional analysis process.

■Disadvantages of general manual scribing and cleavage

・Poor accuracy (actually about 100um) ・Reproducibility and accuracy depend on the operator ・The following processing such as FIB takes time.

■Disadvantages of polishing

・It is necessary to embed the sample in resin, and processing before polishing takes time. ・There are various risks such as over-polishing, stains due to polishing, and load on the sample. ・The cost of consumables such as polishing liquid and polishing buffs is high. ・The condition of the observation point may change depending on the polishing load.

■The process is long and automatic cleavage takes 20 to 50 minutes.

・There are many restrictions on samples (sample size, type, thickness, edge condition) ・In addition to high equipment prices, operation and service costs are high.

■Equipment features

・Fast (within 5 minutes) ・High accuracy (within ±10um) ・High reproducibility regardless of the operator ・Low price ・Maximum sample size: 8 inch wafer or 1/2-300mm wafer ・Minimum sample size: 9mm *For sizes smaller than this, use a special accessory kit ・Ideal for cross-sectional analysis of TSVs and bumps ・Mirror finish

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    Tabletop manual cleavage device PELCO® LatticeAx®

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1 Models of Tabletop manual cleavage device PELCO® LatticeAx®

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Tabletop manual cleavage device PELCO® LatticeAx®-Part Number-PELCO® LatticeAx®

PELCO® LatticeAx®

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About Company Handling This Product

HiSOL,Inc.

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

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