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Failure analysis device Laser package opening device Laser Decap PRO2-Laser Decap PRO2
Failure analysis device Laser package opening device Laser Decap PRO2-HiSOL,Inc.

Failure analysis device Laser package opening device Laser Decap PRO2
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

27.0hours

Relatively Fast Response


About This Product

In recent years, the number of resins that do not dissolve even in strong acids has increased, and new techniques are required to open packages. For large power devices that use hard-to-melt resins, it takes too much time and it is difficult to open them reliably using chemical opening equipment alone. Our laser package opening equipment can open packages at high speed without damaging the metal.

■How to use

If only the 2nd bonding part is exposed, it can be exposed with a laser alone, but if the entire package is opened, the laser will destroy the element if it hits the element, so the resin on the element surface must be removed to a thickness of about 100um using a laser. The remaining resin is removed using a chemical opening device.

■Features

・Real-time observation ・High-resolution camera (12M) clearly observes bonding wires ・No discoloration of printed circuit board (copper is exposed in lasers made by other companies) ・Only the laser diode can be replaced (low price) ・2 years warranty ・Can be marked with QR code or text ・Fast opening without damaging metal ・Ceramic processing

  • Product

    Failure analysis device Laser package opening device Laser Decap PRO2

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1 Models of Failure analysis device Laser package opening device Laser Decap PRO2

Image Part Number Price (excluding tax)
Failure analysis device Laser package opening device Laser Decap PRO2-Part Number-Laser Decap PRO2

Laser Decap PRO2

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About Company Handling This Product

Response Rate

100.0%


Response Time

27.0hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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