All Categories

History

  1. Metoree
  2. Plasma stripper descum equipment CV200RFS (HiSOL,Inc.)
Plasma stripper descum equipment CV200RFS-CV200RFS
Plasma stripper descum equipment CV200RFS-HiSOL,Inc.

Plasma stripper descum equipment CV200RFS
HiSOL,Inc.

About This Product

This is a system that performs stripping and descum using plasma in a low-pressure environment. Compared to the conventional wet etching method, the process does not use chemicals, so it is safer, and the manual load CV200RFS is ideal for R&D and low-volume production applications. Optimal processing conditions can be set with simple touch panel operations.

■Application

・Photoresist removal ・Organic matter removal ・Surface modification ・Removal of contamination (flux etc.) ・Polyimide removal ·etching ・Descum resist residue removal

■Equipment features

・Plasma treatment on a hot plate inside the chamber. Precise temperature control allows you to control the strip rate and also process workpieces that are sensitive to heat. ・You can select any 4 types of gas, and the optional mass flow controller allows you to mix gases and control the flow rate using the CPU. ・Up to 12 types of cleaning conditions can be stored in memory and programs can be easily set using the front panel. ・Plasma output can be set from 100 to 1000W. Can be used in a wide range of applications, from strip/discum applications to surface modification applications, depending on the cleaning target. ・Reliably removes inorganic contamination such as nickel oxide and nickel hydroxide on thin film substrates. ・Strip rate is up to 7,000Å/min

■Chamber design

The plasma generated from the electrode passes through a ground plate with holes and reaches the work surface. This removes electrons (-) from the plasma and minimizes damage to the workpiece. For CMOS devices, etc., damage caused by electrons causes deviations in CV characteristics. The deviation in CV characteristics caused by the plasma treatment of CV200RFS is virtually zero.

■Minimize heat damage

In the CV200RFS, the temperature of the workpiece during plasma irradiation is controlled with high precision by the hot plate on which the workpiece is placed. Additionally, a temperature limit can be set during the process according to the heat resistance of the workpiece, and the plasma will be turned off when the workpiece temperature reaches the set value during the process. Therefore, a heat load exceeding the set value will not be applied to the workpiece. This feature allows us to meet the needs of polyimide strips and ion-implanted photoresist strips, which are sensitive to heat but require long plasma irradiation.

  • Product

    Plasma stripper descum equipment CV200RFS

Share this product


50+ people viewing

Last viewed: 23 hours ago

Free
Get started with our free quotation service - no cost, no obligation.

No Phone Required
We respect your privacy. You can receive quotes without sharing your phone number.

1 Models of Plasma stripper descum equipment CV200RFS

Image Part Number Price (excluding tax) Power supply Weight Setting resolution Temperature stability Body size (approx.) W×D×H Operating temperature Cooling method Number of recipes Mass flow controller Hot plate area Process gas flow rate Process gas Plasma irradiation time Chamber size (approx.) W×D×H Throughput Strip rate Cleanliness Capacity RF plasma N2 flow rate
Plasma stripper descum equipment CV200RFS-Part Number-CV200RFS

CV200RFS

Available upon quote

Single phase 200 – 250V, 20A, 50/60Hz

147kg

1 second

< 10%

61×109×114 cm

Room temperature –250℃

Forced air cooling

12 recipes

Options Up to 4 pieces

Up to 200mm wafer

20–50 SCCM

4 types

0–1,200 seconds

25×29×5 cm

1 wafer/min

Up to 7,000Å/min

Class 10

Single 50–200mm wafer
Double 100mm wafer

40kHz, 100 – 1,000W

Up to 1.7 SCFM

Other products of HiSOL,Inc.

Reviews shown here are reviews of companies.

Probe card-HiSOL,Inc.

Probe card

HiSOL,Inc.

240+ people viewing

Last viewed: 5 hours ago

Response time: 26.74 hours

Probe Cards

2 models listed

Atmospheric pressure lamp annealing equipment RTP/RTA 8 inch compatible AccuThermo AW820M-HiSOL,Inc.

Atmospheric pressure lamp annealing equipment RTP/RTA 8 inch compatible AccuThermo AW820M

HiSOL,Inc.

170+ people viewing

Last viewed: 6 hours ago

Response time: 26.74 hours

Annealing Furnaces
IC socket burn-in test-HiSOL,Inc.

IC socket burn-in test

HiSOL,Inc.

180+ people viewing

Last viewed: 3 hours ago

Response time: 26.74 hours

BGA Scokets

2 models listed

Capillary for ball bonding-HiSOL,Inc.

Capillary for ball bonding

HiSOL,Inc.

190+ people viewing

Last viewed: 9 hours ago

Response time: 26.74 hours

Capillaries

3 models listed

Tabletop UV curing furnace lamp type UV PITARI-HiSOL,Inc.

Tabletop UV curing furnace lamp type UV PITARI

HiSOL,Inc.

190+ people viewing

Response time: 26.74 hours

Ultraviolet (UV) Dryers

2 models listed

Measuring Instruments/Measuring Systems Ellipsometer-HiSOL,Inc.

Measuring Instruments/Measuring Systems Ellipsometer

HiSOL,Inc.

190+ people viewing

Response time: 26.74 hours

Ellipsometers
Laser microprocessing equipment-HiSOL,Inc.

Laser microprocessing equipment

HiSOL,Inc.

180+ people viewing

Response time: 26.74 hours

Microfabrication Machines
Tabletop multi-wire bonder (ball & wedge type) MODEL-7KE-HiSOL,Inc.

Tabletop multi-wire bonder (ball & wedge type) MODEL-7KE

HiSOL,Inc.

290+ people viewing

Response time: 26.74 hours

Semiconductor Manufacturing Equipment Component & Part Machining

3 models listed

Desktop manual wedge bonder E series-HiSOL,Inc.

Desktop manual wedge bonder E series

HiSOL,Inc.

260+ people viewing

Last viewed: 24 minutes ago

Response time: 26.74 hours

Wire Bonders
Tabletop manual deep access wedge bonder MODEL-7476D (7600D specification)-HiSOL,Inc.

Tabletop manual deep access wedge bonder MODEL-7476D (7600D specification)

HiSOL,Inc.

290+ people viewing

Response time: 26.74 hours

Wire Bonders
Die Bonder Epoxy Die Bonder Model 7200CR-HiSOL,Inc.

Die Bonder Epoxy Die Bonder Model 7200CR

HiSOL,Inc.

180+ people viewing

Last viewed: 8 hours ago

Response time: 26.74 hours

Flip Chip Bonders
Auto flip chip bonder MODEL-400-HiSOL,Inc.

Auto flip chip bonder MODEL-400

HiSOL,Inc.

320+ people viewing

Last viewed: 23 hours ago

Response time: 26.74 hours

Flip Chip Bonders

2 models listed


View more products of HiSOL,Inc.

About Company Handling This Product

HiSOL,Inc.

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

See More

  • Japan

This is the version of our website addressed to speakers of English in the United States. If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.

Copyright © 2025 Metoree