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  4. Vacuum gas displacement polyimide cure oven 450PB8-2P-CP (HiSOL,Inc.)
Vacuum gas displacement polyimide cure oven 450PB8-2P-CP-450PB8-2P-CP
Vacuum gas displacement polyimide cure oven 450PB8-2P-CP-HiSOL,Inc.

Vacuum gas displacement polyimide cure oven 450PB8-2P-CP
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

40.5hours

About This Product

This is a tabletop batch oven that can be heated in a vacuum environment or inert gas atmosphere (N2, Ar etc.). Temperature control recipes can be easily set on the touch panel screen on the front of the device. Achieves heat treatment in a clean environment while maintaining high temperature distribution uniformity within the chamber.

■Application

・Polyimide, BCB (photosensitive resin resistant to heat above 350 degrees), low-k material (interlayer insulation film material) curing ・Curing of polyimide film (insulating film) in WLP (wafer level packaging) and RDL (redistribution layer formation) processes ・Cu, Al annealing ・Cu oxide film removal etc…

■Equipment features

・Heat treatment in a clean environment ・Up to 450℃ heating, high temperature uniformity ・Reliably removes oxygen in the chamber (oxygen concentration 10ppm or less, oxygen concentration monitor option available) ・The patented laminar flow method keeps the workpiece and chamber clean after heat treatment. ・Independent air-cooled cabinet system cools the chamber without affecting the work being heated ・Easily create recipes using the front touch panel display. Number of recipe memories is 8 types ・Reduced gas consumption by creating a low-pressure environment inside the chamber and performing heat treatment chamber design

■Patented laminar flow method

The YES PB series chamber has a gas generation plenum on top and a suction plenum on the bottom, allowing preheated process gas (usually N2) to flow parallel to the vertically placed wafer. Laminar flow (parallel laminar flow) is effective in removing and preventing particles from adhering to the workpiece surface.

■Equipped with a particle removal filter inside the chamber

The preheated process gas passes through a 100um particle filter, reaches the workpiece, passes through the workpiece, passes through the filter again, and is discharged outside the chamber. In addition to being able to heat the workpiece in a clean environment, it prevents particle scattering and eliminates the effect on chamber vacuum exhaust and gas inlet.

■Convection cooling mechanism

The 450PB chamber is surrounded by a separate cabinet equipped with cooling air inlets and exhaust ducts. All cooling is done from outside the chamber, so the workpieces being processed inside are not exposed to cooling air. In addition, the temperature of the air after cooling the chamber is lowered before exhausting, and the air is exhausted in a safe manner.

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    Vacuum gas displacement polyimide cure oven 450PB8-2P-CP

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1 Models of Vacuum gas displacement polyimide cure oven 450PB8-2P-CP

Image Part Number Price (excluding tax) Power supply voltage Weight (approx.) Oxygen concentration Applicable clean room Setting time Temperature uniformity (25 sheets/cassette) Time setting resolution Average heating rate (150-450℃) Average cooling rate (450-150℃) External dimensions (approx.) W×D×H Operating temperature Control unit dimensions (approx.) W×D×H Number of recipes Mass flow controller Process gas input Process area dimensions (approx.) W×D×H Chamber material Chamber internal dimensions (approx.) ID x D Cleanliness inside the chamber Number of steps Capacity (25 sheets/cassette) N2 flow rate (consumption)
Vacuum gas displacement polyimide cure oven 450PB8-2P-CP-Part Number-450PB8-2P-CP

450PB8-2P-CP

Available upon quote

Three phase 208V 40A 50/60Hz

261 kg

10 ppm or less
Option: Oxygen concentration meter

Class 10

0–99 hours

±5℃

1 minute

7.5℃/min

4.5℃/min

69×146×78cm

Room temperature – 450℃ (optional 550℃)

59×96×24 cm

8

Options (up to 3 lines can be added)

Standard 1 system (optional 3 systems)

24×46×25cm

SUS 316L

37×66.5cm

Class 1

16

8″ wafer
2 cassettes

1 SCFM (15-25 liters/min)

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About Company Handling This Product

HiSOL,Inc.

Response Rate

100.0%

Response Time

40.5hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

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Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　HiSOL,Inc.
HiSOL,Inc.

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