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  4. Failure analysis equipment Wire bonder/die bonder for failure analysis (HiSOL,Inc.)
Failure analysis equipment Wire bonder/die bonder for failure analysis-Wire bonder/die bonder for failure analysis
Failure analysis equipment Wire bonder/die bonder for failure analysis-HiSOL,Inc.

Failure analysis equipment Wire bonder/die bonder for failure analysis
HiSOL,Inc.

About This Product

A desktop wire bonder and die bonder ideal for failure analysis applications. Since it is operated using an X-Y-Z 3-axis manipulator (patented), it can solve various problems when opening the package. By using this device, customers will be able to handle samples (workpieces) that they had previously given up on.

■Example

・Electrode regeneration (pad regeneration) ・Wire on Wire ・Bump on Wire ・Paste wiring, etc.

  • Product

    Failure analysis equipment Wire bonder/die bonder for failure analysis

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1 Models of Failure analysis equipment Wire bonder/die bonder for failure analysis

Image Part Number Price (excluding tax)
Failure analysis equipment Wire bonder/die bonder for failure analysis-Part Number-Wire bonder/die bonder for failure analysis

Wire bonder/die bonder for failure analysis

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About Company Handling This Product

HiSOL,Inc.

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

Related search keywords

Wire Bonders
Wire Bonders　HiSOL,Inc.
HiSOL,Inc.

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