Failure analysis device Ultrasonic imaging device IS-350
HiSOL,Inc.
About This Product
This is a non-destructive analysis device that visualizes defects with spaces such as voids, cracks, and peeling. This is a water immersion type ultrasonic flaw detection device that inspects the inside of products such as IC packages and metal materials.
■Target application
・Voids and peeling of solder, adhesive, and underfill
・Delamination of ceramic capacitors
・Poor bonding of bonded wafers
・Evaluation of welded parts
・Crack in material
・Delamination of IC packages
■Features
・Low price・High performance
・Measure multiple gates simultaneously
・Captures all waveform data and enables tomographic observation like CT scan
・Pinpoint adjustment of the gain of the selected waveform region
・Also compatible with transmission method
・Water deaeration and temperature control options available
・Automatically determine pass/fail based on the area ratio of voids and peeling
・Automatic detection of sample position
・Flaw detection frequency up to 500MHz (optional)
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Product
Failure analysis device Ultrasonic imaging device IS-350
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Handling Company
HiSOL,Inc.
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Categories
1 Models of Failure analysis device Ultrasonic imaging device IS-350
| Product Image | Part Number | Price (excluding tax) | Device size | Effective scan area |
|---|---|---|---|---|
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IS-350 |
Available upon quote | W700xD750xH1,300mm (equipment body) |
・Standard: 350x350mm ・Medium size option: 450x450mm ・Large option: 600x600mm |
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About Company Handling This Product
- Japan