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Failure analysis device Ultrasonic imaging device IS-350-IS-350
Failure analysis device Ultrasonic imaging device IS-350-HiSOL,Inc.

Failure analysis device Ultrasonic imaging device IS-350
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

29.2hours

Relatively Fast Response


About This Product

This is a non-destructive analysis device that visualizes defects with spaces such as voids, cracks, and peeling. This is a water immersion type ultrasonic flaw detection device that inspects the inside of products such as IC packages and metal materials.

■Target application

・Voids and peeling of solder, adhesive, and underfill ・Delamination of ceramic capacitors ・Poor bonding of bonded wafers ・Evaluation of welded parts ・Crack in material ・Delamination of IC packages

■Features

・Low price・High performance ・Measure multiple gates simultaneously ・Captures all waveform data and enables tomographic observation like CT scan ・Pinpoint adjustment of the gain of the selected waveform region ・Also compatible with transmission method ・Water deaeration and temperature control options available ・Automatically determine pass/fail based on the area ratio of voids and peeling ・Automatic detection of sample position ・Flaw detection frequency up to 500MHz (optional)

  • Product

    Failure analysis device Ultrasonic imaging device IS-350

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1 Models of Failure analysis device Ultrasonic imaging device IS-350

Image Part Number Price (excluding tax) Device size Effective scan area
Failure analysis device Ultrasonic imaging device IS-350-Part Number-IS-350

IS-350

Available upon quote

W700xD750xH1,300mm (equipment body)

・Standard: 350x350mm
・Medium size option: 450x450mm
・Large option: 600x600mm

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About Company Handling This Product

Response Rate

100.0%


Response Time

29.2hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

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