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  4. Automatic CMP equipment Tribo/Orbis series (HiSOL,Inc.)
Automatic CMP equipment Tribo/Orbis series-Tribo
Automatic CMP equipment Tribo/Orbis series-Orbis
Automatic CMP equipment Tribo/Orbis series-HiSOL,Inc.

Automatic CMP equipment Tribo/Orbis series
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

40.5hours

About This Product

■Features

・It monitors COF (coefficient of friction), pad surface temperature, polishing liquid temperature, room temperature inside the device, etc., and upper limits can be set using these parameters. For example, when the pad temperature or COF increases, polishing can be stopped. You can stop it. ・Two types of pressure (load) work: "Download" allows the head to be pressed against the sample using the force of the diaphragm, and "Back pressure" allows air to flow into the grooves inside the carrier head, causing the surface (aluminum) itself to The head is lifted and deformed by the air that has no place to escape, and pressure can be applied to the sample (the surface of the head itself deforms and applies pressure). At 25 psi the head surface is flat, above 26 psi it swells, and below 24 psi it becomes concave. This pressure can be set after checking the sample for warpage, so even warped wafers can be polished uniformly. -Equipped with multiple slurry pumps, slurry can be automatically switched depending on the process.

■Process control

- All parameters can be set using the touch panel. Slurry switching is also automatic. ・Multiple process parameters can be monitored during polishing, and data can be saved and output for analysis. The parameters that can be monitored and saved are as follows. ・Friction coefficient ・Pad temperature ・Slurry temperature (both supply side and waste liquid side) *Acidic slurry can also be used ・Ambient temperature

■Wafer carrier head

・Lightweight design, special mechanism for easy removal ・Template compatible with all wafer sizes (chips also available) ・3 types of carrier heads for Orbis (4, 6, 8 inches)

■Shape control (back pressure)

・Back pressure (0–50 psi) to control unevenness ・Even wafers warped by back pressure can be polished uniformly. ・By using Logitech's interferometer (GI20), it is possible to adjust the shape of the wafer more precisely.

  • Product

    Automatic CMP equipment Tribo/Orbis series

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2 Models of Automatic CMP equipment Tribo/Orbis series

Click on the part number for more information about each product

Image Part Number Price (excluding tax) Type
Automatic CMP equipment Tribo/Orbis series-Part Number-Tribo

Tribo

Available upon quote

Maximum sample diameter: 4 inches x 2 pieces

Automatic CMP equipment Tribo/Orbis series-Part Number-Orbis

Orbis

Available upon quote

Maximum sample diameter: 8 inches x 2 pieces

Click on the part number for more information about each product

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About Company Handling This Product

HiSOL,Inc.

Response Rate

100.0%

Response Time

40.5hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

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