Double-sided semi-automatic prober HSP-200DS (8 inch)
HiSOL,Inc.
About This Product
We offer custom double-sided semi-automatic probe systems that allow access to both the front and back sides of the wafer. It can be used for evaluating various flip-chip type light receiving and emitting elements, failure analysis such as backside emission observation, double side probing, etc.
■Application
・On-wafer evaluation of optoelectronics (receiving and emitting elements), chip evaluation after dicing
・Backside emission observation (for failure analysis)
・Low ON resistance measurement of power devices (double side probing)
・Automatic probing of elements aligned on dicing tape
・Supports defective die marking (inker, scribe)
・Equipped with a laser cutter (point marking, protective film peeling, wiring cutting)
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Product
Double-sided semi-automatic prober HSP-200DS (8 inch)
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Handling Company
HiSOL,Inc.
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Categories
1 Models of Double-sided semi-automatic prober HSP-200DS (8 inch)
| Product Image | Part Number | Price (excluding tax) | Back side platen Z movement range | Compatible wafer size | Stage XY movement range | Stage XY positioning accuracy | Stage XY repeat accuracy | Stage Z movement range | Stage Z repeat accuracy | Stage θ movement range | Stage θ positioning resolution | System dimensions (W×D×H) | System weight |
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HSP-200DS (8 inch) |
Available upon quote | 20mm (manual/automatic selection) | ~φ200mm | X: 210mm, Y: 300mm | ＜±5um | ＜±2um | 20mm | ＜±1um | ±5° | 0.0002° | 1,700×1,200×1,700mm | Approximately 850kg |
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About Company Handling This Product
- Japan