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  4. Semi-automatic prober for small diameter wafers HSP-150 (6 inch) (HiSOL,Inc.)
Semi-automatic prober for small diameter wafers HSP-150 (6 inch)-HSP-150 (6 inch)
Semi-automatic prober for small diameter wafers HSP-150 (6 inch)-HiSOL,Inc.

Semi-automatic prober for small diameter wafers HSP-150 (6 inch)
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

33.8hours

Relatively Fast Response

About This Product

The HSP-100 and HSP-150 semi-automatic probe systems are standard semi-automatic probe systems that can measure small diameter wafers up to 4 inches (100mm) or up to 6 inches (150mm). It features a mechanical mechanism with high rigidity and excellent positioning accuracy and repeatability, intuitive and easy operability, advanced control software, and low noise and high precision measurement, supporting highly reliable semi-automatic on-wafer measurement. With a highly flexible design concept and a wide variety of options, it is compatible with a wide range of applications such as small signal I-V/C-V measurements, impedance characteristic evaluations, high-power device measurements, sub-THz band RF measurements, and optoelectronic measurements. It is a highly scalable system. It is possible to install a high temperature chuck with a temperature control range of +15℃ to +300℃ (special option +400℃).

■Application

・Temperature characteristic test from +15℃/+25℃ to +200℃/+300℃ ・Minute signal I-V measurement (fA level) ・Various C-V measurements (Quasi-Static C-V, HF-CV, RF-CV), impedance characteristic evaluation ・RF measurement (~67GHz) *Option: sub THz band RF measurement ・Ultra high-speed I-V measurement

■Extended application

・Equipped with a laser cutter (point marking, protective film peeling, wiring cutting) ・Optoelectronics (LED, LD, VCSEL, PD, etc.) reception/emission characteristics evaluation application ・Sub THz band RF measurement ・Load pull measurement ・Testing of flat panel display devices ・Wafer level reliability testing (EM, TDDB, HCI, NBTI, BT, etc.) ・Automatic probing of devices aligned on dicing tape, chip trays, and gel packs ・Defective die marking (inker, scribe) ・High power device measurement (200A Pulse, ±3kV triaxial, ±10kV coaxial) ・Probe card compatible (Multi-site WLR compatible)

  • Product

    Semi-automatic prober for small diameter wafers HSP-150 (6 inch)

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1 Models of Semi-automatic prober for small diameter wafers HSP-150 (6 inch)

Image Part Number Price (excluding tax) Compatible wafer size External dimensions/weight Stage θ movement range Stage θ positioning resolution Stage Z repeat accuracy Stage Z movement range Stage XY repeat accuracy Stage XY movement range Stage XY positioning accuracy
Semi-automatic prober for small diameter wafers HSP-150 (6 inch)-Part Number-HSP-150 (6 inch)

HSP-150 (6 inch)

Available upon quote

~φ150mm

W1,500×D1,000×H1,690mm
Approximately 670kg

±7.5°

0.0002°

＜±1um

20mm

<±1.5um

X: 210mm, Y: 300mm

<±3um

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About Company Handling This Product

HiSOL,Inc.

Response Rate

100.0%

Response Time

33.8hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

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