Semi-automatic prober for high and low temperatures HSP-300SC (12 inch)
HiSOL,Inc.
About This Product
The HSP-200SC/HSP-300SC semi-automatic prober is a semi-automatic probe system compatible with next-generation semiconductor devices that pursues low noise and low leakage for measuring up to 8 inches (200 mm) or up to 12 inches (300 mm) wafers.
The probe and chuck are housed in a completely EMI-shielded environment with a shielded chamber structure, and the temperature control range -60°C to +300°C (special option +400°C) allows for ultra-small I-V signals in the extreme range. It supports automatic in-plane measurements such as C-V measurement, 1/f noise measurement, S-parameter acquisition, RTN (random telegraph noise) measurement, and high-speed I-V measurement. It is also available as an option for large current and high voltage power device applications.
■Application
・Temperature characteristic test from -60℃/-40℃ to +200℃/+300℃
・Testing in an inert gas environment such as N2 or Ar (dew point temperature -70℃ or less, residual oxygen concentration 100ppm or less)
・Minute signal I-V measurement (fA level)
・Various C-V measurements (Quasi-Static C-V, HF-CV, RF-CV), impedance characteristic evaluation
・RF measurement (~67GHz) *Option: sub THz band RF measurement
・1/f noise evaluation
・RTN (Random Telegraph Noise) evaluation
・Ultra high-speed I-V measurement
・High power device measurement (200A Pulse, ±3kV triaxial, ±10kV coaxial)
・Probe card compatible (Multi-site WLR compatible)
■Extended application
・Optoelectronics (LED, LD, VCSEL, PD, etc.) reception/emission characteristics evaluation application
・Sub THz band RF measurement ・Load pull measurement
・Wafer level reliability testing (EM, TDDB, HCI, NBTI, BT, etc.) *Continuous testing for over 240 hours is possible
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Product
Semi-automatic prober for high and low temperatures HSP-300SC (12 inch)
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Handling Company
HiSOL,Inc.
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Categories
1 Models of Semi-automatic prober for high and low temperatures HSP-300SC (12 inch)
| Product Image | Part Number | Price (excluding tax) | Compatible wafer size | Stage XY movement range | Stage XY positioning accuracy | Stage XY repeat accuracy | Stage Z movement range | Stage Z repeat accuracy | Stage θ movement range | Stage θ positioning resolution | System dimensions (W×D×H) | System weight |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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HSP-300SC (12 inch) |
Available upon quote | ~φ300mm | X: 310mm, Y: 310mm | ＜±5um | ＜±2um | 20mm | ＜±1um | ±7.5° | 0.0002° | 1,700×1,200×1,600mm | Approximately 1,100kg |
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About Company Handling This Product
- Japan