Standard semi-automatic prober HSP-200 (8 inch)
HiSOL,Inc.
About This Product
The HSP-200 semi-automatic prober is a standard type semi-automatic probe system that can measure up to 8 inches (200 mm) wafers. It features a mechanical mechanism with high rigidity and excellent positioning accuracy and repeatability, intuitive and easy operability, advanced control software, and low noise and high precision measurement, supporting highly reliable semi-automatic on-wafer measurement.
With a highly flexible design concept and a wide variety of options, it is compatible with a wide range of applications such as small signal I-V/C-V measurements, impedance characteristic evaluations, high-power device measurements, sub-THz band RF measurements, and optoelectronic measurements. It is a highly scalable system.
It is possible to install a high temperature chuck with a temperature control range of +15℃ to +300℃ (special option +400℃).
■Application
・Temperature characteristic test from +15℃/+25℃ to +200℃/+300℃
・Minute signal I-V measurement (fA level)
・Various C-V measurements (Quasi-Static C-V, HF-CV, RF-CV), impedance characteristic evaluation
・RF measurement (~67GHz) *Option: sub THz band RF measurement
・Ultra high-speed I-V measurement
・High power device measurement (200A Pulse, ±3kV triaxial, ±10kV coaxial)
■Extended application
・Equipped with a laser cutter (point marking, protective film peeling, wiring cutting)
・Optoelectronics (LED, LD, VCSEL, PD, etc.) reception/emission characteristics evaluation application
・Sub THz band RF measurement ・Load pull measurement
・Testing of flat panel display devices
・Wafer level reliability testing (EM, TDDB, HCI, NBTI, BT, etc.)
・Automatic probing of devices aligned on dicing tape, chip trays, and gel packs
・Defective die marking (inker, scribe)
・Probe card compatible (Multi-site WLR compatible)
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Product
Standard semi-automatic prober HSP-200 (8 inch)
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Handling Company
HiSOL,Inc.
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Categories
1 Models of Standard semi-automatic prober HSP-200 (8 inch)
| Product Image | Part Number | Price (excluding tax) | Compatible wafer size | External dimensions/weight | Stage XY movement range | Stage XY positioning accuracy | Stage XY repeat accuracy | Stage Z movement range | Stage Z repeat accuracy | Stage θ movement range | Stage θ positioning resolution |
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HSP-200 (8 inch) |
Available upon quote | ~φ200mm | W1,700×D1,000×H1,690mm・Approx. 700kg | X: 210mm, Y: 300mm | <±3um | <±1.5um | 20mm | ＜±1um | ±7.5° | 0.0002° |
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About Company Handling This Product
- Japan