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Plasma cleaner SPE-2136A
Sanko Ematech Co., Ltd.

Sanko Ematech Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

30.9hours

Relatively Fast Response


About This Product

Descum, surface modification, and ashing treatments are available for φ4 inch to φ6 inch wafers. Equipped with an automatic transfer mechanism, it helps prevent wafer cracking and reduces work time and costs associated with wafer transfer. The process chamber achieves high throughput by processing two wafers simultaneously.

■Features

・C to C ・High throughput ・Distribution: Within wafer ±10% or less (Si substrate) - Simultaneous processing of two sheets, low temperature processing

■Options

・Ar plasma cleaning ・Static electricity countermeasures using ionizer

■Applications and application examples

・Resist removal for various wafer electronic components ・Surface modification before post-process plating ・Organic pollution removal ・Surface modification of resin materials ・Supports ultra-thin piezoelectric wafers such as SAW devices

  • Product

    Plasma cleaner SPE-2136A

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0 Models of Plasma cleaner SPE-2136A

Image Part Number Price (excluding tax) Power system Equipment weight Device configuration Exhaust system Exhaust time External dimensions (device body) Control system Ultimate pressure Utility (6) Utility (5) Utility (4) Utility (3) Utility (2) Utility (1) Cycle time Gas introduction system Ashing distribution

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About Company Handling This Product

Response Rate

100.0%


Response Time

30.9hrs


Company Review

5.0
  • Japan

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