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  4. Plasma cleaner SPE-2136A (Sanko Ematech Co., Ltd.)

Plasma cleaner SPE-2136A
Sanko Ematech Co., Ltd.

Sanko Ematech Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

42.2hours

Company Review

5.0

About This Product

Descum, surface modification, and ashing treatments are available for φ4 inch to φ6 inch wafers. Equipped with an automatic transfer mechanism, it helps prevent wafer cracking and reduces work time and costs associated with wafer transfer. The process chamber achieves high throughput by processing two wafers simultaneously.

■Features

・C to C ・High throughput ・Distribution: Within wafer ±10% or less (Si substrate) - Simultaneous processing of two sheets, low temperature processing

■Options

・Ar plasma cleaning ・Static electricity countermeasures using ionizer

■Applications and application examples

・Resist removal for various wafer electronic components ・Surface modification before post-process plating ・Organic pollution removal ・Surface modification of resin materials ・Supports ultra-thin piezoelectric wafers such as SAW devices

  • Product

    Plasma cleaner SPE-2136A

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Last viewed: 14 hours ago

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1 Models of Plasma cleaner SPE-2136A

Image Part Number Price (excluding tax) Power system Equipment weight Device configuration Exhaust system Exhaust time External dimensions (device body) Control system Ultimate pressure Utility (6) Utility (5) Utility (4) Utility (3) Utility (2) Utility (1) Cycle time Gas introduction system Ashing distribution

SPE-2136A

Available upon quote

(1) RF power supply MAX1,000W (13.56MHz)
(2) Matching box auto matching specification

1,000kg

(1) Consists of a transfer area equipped with a transfer robot and an ashing room
(2) The vacuum chamber material is made of degreased A5052.

Dry pump 1 set

Within 18 seconds to 10Pa

W1,340mm×D1,945mm×H1,870mm

(1) Fully automatic operation is possible by using a sequencer
(2) The number of substrates processed is always displayed on the touch panel, and error history can be checked.
(3) Manage recipes and acquire logs using the attached computer.

1Pa or less

Earth: Class A earth

N2 gas: 0.3MPa 60ℓ/min

O2 gas: 0.05MPa for process

Compressed air: 0.5MPa 20ℓ/min

Cooling water: 20~25℃　0.36㎥/hr (6ℓ/min)

Power: 200V 3φ 50/60Hz 14.3KVA

45 seconds (18 sheets/cassette, φ4 inch board)
*This is a reference value.

Mass flow controller for O2 gas 1 set

Within ±10%

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About Company Handling This Product

Sanko Ematech Co., Ltd.

Response Rate

100.0%

Response Time

42.2hrs

Company Review

5.0
  • Japan

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