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Laser microprocessing equipment-Laser microprocessing equipment
Laser microprocessing equipment-HiSOL,Inc.

Laser microprocessing equipment
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

40.5hours

About This Product

At Hisol Co., Ltd., we design and manufacture laser systems for thin film processing based on customer specifications. By combining a wealth of processing examples, mechatronic design technology, precision positioning technology, and software development technology, we can provide the optimal system for your laser thin film processing application.

■Features

・Processing under atmospheric pressure ・Laser processing size can be adjusted from 1um to 300um□ - Compatible with multiple wavelengths (1064,532,355,266nm), allowing cutting of a variety of materials ・Real-time processing (processing is possible while observing the processing state with a microscope) ・JIS-C6802 Class 1 laser safety measures ・Easy maintenance

■Applications

・Point marking before FIB and SEM ・Removal of IC protective film and interlayer film ・Cut the metal wiring of IC ・Patterning of organic devices, etc. ・Repair of LCD display and color filter ・Short defect repair for thin film and thick film patterns ・Trimming of high frequency capacitor ・Fuse cutting for LSI defect relief, etc.

■Laser oscillation wavelength and material to be processed

- Laser oscillation wavelength can be selected from 4 wavelengths according to the material to be processed. (1 wavelength to maximum 4 wavelengths) ・1,064nm, 532nm thermal processing ・355nm, 266nm ablation processing

  • Product

    Laser microprocessing equipment

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1 Models of Laser microprocessing equipment

Image Part Number Price (excluding tax) Microscope illumination Vibration isolation system Resistance measurement – ​​automatic trimming Safety measures Loader/unloader compatible Laser oscillator wavelength Laser oscillation frequency Laser maximum output energy Laser processing size Stage movement amount Stage method Number of stage control axes Stage positioning accuracy Auto focus
Laser microprocessing equipment-Part Number-Laser microprocessing equipment

Laser microprocessing equipment

Available upon quote

Coaxial epi-illumination (standard)
Transmitted illumination/diffuse illumination/dark field (optional)

Passive/active (optional)

Available *Consultation required

Compliant with JIS-C6802 (radiation safety standards for laser products)

Available *Consultation required

1,064nm/532nm/355nm/266nm

30Hz/60Hz

~12mJ *Depends on oscillator model and selected laser wavelength

＜1um□~300um□ *Depends on selected laser wavelength and objective lens configuration

100mm□~500mm□ *Please consult us for more than 500mm□

Manual / automatic

XYZθ 4 axes (standard)

XY ＜±5um (standard)
XY <±1um (optional) *Semi-auto model, varies depending on stage movement

Tracking AF, contrast AF (optional)

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About Company Handling This Product

HiSOL,Inc.

Response Rate

100.0%

Response Time

40.5hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

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Microfabrication Machines
Microfabrication Machines　HiSOL,Inc.
HiSOL,Inc.

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