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  4. Capillary for ball bonding (HiSOL,Inc.)
Capillary for ball bonding-Capillary for ball bonding
Capillary for ball bonding-HiSOL,Inc.

Capillary for ball bonding
HiSOL,Inc.

About This Product

Advances in new mounting technology require optimization of ball/stitch bonds in the wire bonding process. Among these, the capillaries we offer are of the highest quality, with stable bond formation and long life.

■Standard capillary

Capillary made of alumina ceramic.

■Custom capillary

Everything from the tip shape to the tool material is custom-made.

■Capillary for ball bump

・Capillary exclusively for bump bonding. ・This is a custom-made capillary made according to your desired ball size.

■Capillary for small ball

- Capillary for small balls and narrow pitches. - Compatible with both wire bonding and bump bonding.

■Capillary for fine pitch (bottleneck capillary)

Bottleneck capillary with pad pitch of 50μm to 100μm.

■Capillary for ultra-fine pitch ball bonding

Bottleneck capillary compatible with pad pitch of 50μm or less.

■Material

・Alumina ceramic ・Zirconia reinforced ceramic ・Tungsten carbide

  • Product

    Capillary for ball bonding

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1 Models of Capillary for ball bonding

Image Part Number Price (excluding tax)
Capillary for ball bonding-Part Number-Capillary for ball bonding

Capillary for ball bonding

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About Company Handling This Product

HiSOL,Inc.

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

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Capillaries　HiSOL,Inc.
HiSOL,Inc.

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