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Atmospheric pressure lamp annealing equipment RTP/RTA 8 inch compatible AccuThermo AW820MHandling Company
HiSOL,Inc.Categories
| Image | Part Number | Price (excluding tax) | In-plane temperature uniformity | Cooling rate | Weight | Sample loading method | Number of registered recipes | Temperature measurement accuracy | Temperature control range TC | Temperature control range (Option) Pyrometer | Temperature control range (Option) Special-TC | Temperature control method | Heating rate | Compatible board size | Safety measures | External dimensions | Heating method | Heating direction | Cooling method | Number of steps per recipe | Number of lamp zones | Process control method | Process processing room/sample loading section | Number of process gas lines | Process gas type | Process gas flow control range | Chamber material | Chamber cooling method | Main features of the software |
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AccuThermo AW820M |
Available upon quote |
ΔT 10℃ *Representative value based on standard Si wafer. It varies depending on the material and heat capacity of the sample. |
10℃/sec~150℃/sec *Representative value based on standard Si wafer. It varies depending on the material and heat capacity of the sample. It is also limited by the physical cooling rate. |
460kg *Dimensions and weight do not include peripheral equipment. |
Front loading (manual) |
No limit |
TC: ±1℃ (after calibration), ERP pyrometer: ±4℃ (after calibration) |
100℃~800℃ |
450℃~1,250℃ *Representative value based on standard Si wafer. It varies depending on the material and heat capacity of the sample. |
100℃~1,050℃ *Representative value based on standard Si wafer. It varies depending on the material and heat capacity of the sample. |
Closed-loop control with sensed temperature feedback |
10℃/sec~150℃/sec *Representative value based on standard Si wafer. It varies depending on the material and heat capacity of the sample. |
Standard: φ5 inch ~ φ8 inch, option: φ2 inch ~ φ4 inch, option: 200 mm x 200 mm square board, option: when using susceptor: individual chip ~ φ8 inch |
Emergency stop switch, excessive temperature detection, cooling water monitoring, door opening/closing monitoring, watchdog timer, etc. |
W978×D1,220×H1,780mm |
Infrared lamp radiant heating (1.5kW x 27, Top 13, Bottom 14) |
2 directions, top and bottom |
Forced air cooling with gas purge |
Up to 40 steps (up to 99 loops supported for cyclic annealing) |
10 zone independent control |
Equipment embedded computer board, RTAPro software, 17-inch touch screen, keyboard, mouse |
Quartz tube, quartz tray |
Standard: 1 system (N2) |
N2, O2, He, Ar, forming gas (hydrogen concentration approximately 5%) |
Standard: 0.2slpm~10slpm (controlled by MFC) |
Aluminum alloy + diffuse reflective Au coating |
Combined air cooling and water cooling |
Real-time process monitoring, recipe editing/save/reading, process data recall, process data output (Txt format), various calibrations, system diagnosis, etc. |
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