Packaging specifications for parts for semiconductor manufacturing equipment Tetra-Tetra
Packaging specifications for parts for semiconductor manufacturing equipment Tetra-iRop Co., Ltd.

Packaging specifications for parts for semiconductor manufacturing equipment Tetra
iRop Co., Ltd.


About This Product

■Using human psychology to create a packaging that strictly prohibits tipping over. In order to protect fragile products that can be damaged simply by turning them horizontally, we have developed a packaging format that allows them to be handled vertically from packaging to on-site unpacking. We developed a container with a special shape and designed a buffer to secure the interior. In addition to its trapezoidal shape when viewed from the side, it also has a handle attached to the top. For this reason, it is highly unlikely that the product will fall on its side or be placed upside down during transportation. We take advantage of the characteristics of plastic cardboard to create a special form. ■Idea products that consider human psychology ・Considering the safety of the product when storing and taking it out, the product is designed to always face upwards, so that the product can be kept upright from packaging to unpacking. ・Because the handbag is on the top, people naturally carry the container by holding it on top.

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    Packaging specifications for parts for semiconductor manufacturing equipment Tetra

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1 Models of Packaging specifications for parts for semiconductor manufacturing equipment Tetra

Product Image Part Number Price (excluding tax)
Packaging specifications for parts for semiconductor manufacturing equipment Tetra-Part Number-Tetra

Tetra

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