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  4. Printed wiring boards/substrates High-density substrates (Kyocera Corporation)
Printed wiring boards/substrates High-density substrates-MCM (Mulch chip module)
Printed wiring boards/substrates High-density substrates-MSAP board
Printed wiring boards/substrates High-density substrates-Kyocera Corporation

Printed wiring boards/substrates High-density substrates
Kyocera Corporation

About This Product

■High-density printed wiring board compatible with narrow pitch devices

High-density printed wiring boards are substrates designed to house very small and complex electronic circuits. It features fine conductor lines and a high-density wiring pattern, which allows for smaller size and higher performance. Mainly used in fields such as communication equipment, high-performance computers, and in-vehicle equipment, they contribute to making electronic equipment smaller, lighter, and more powerful, supporting the advancement of advanced technology.

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    Printed wiring boards/substrates High-density substrates

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2 Models of Printed wiring boards/substrates High-density substrates

Click on the part number for more information about each product

Image Part Number Price (excluding tax)
Printed wiring boards/substrates High-density substrates-Part Number-MCM (Mulch chip module)

MCM (Mulch chip module)

Available upon quote
Printed wiring boards/substrates High-density substrates-Part Number-MSAP board

MSAP board

Available upon quote

Click on the part number for more information about each product

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Kyocera Corporation

  • Japan

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Printed Circuit Boards
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