Printed wiring boards/substrates High-density substrates
Kyocera Corporation
About This Product
■High-density printed wiring board compatible with narrow pitch devices
High-density printed wiring boards are substrates designed to house very small and complex electronic circuits. It features fine conductor lines and a high-density wiring pattern, which allows for smaller size and higher performance. Mainly used in fields such as communication equipment, high-performance computers, and in-vehicle equipment, they contribute to making electronic equipment smaller, lighter, and more powerful, supporting the advancement of advanced technology.
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Product
Printed wiring boards/substrates High-density substrates
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Handling Company
Kyocera Corporation
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Categories
2 Models of Printed wiring boards/substrates High-density substrates
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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MCM (Mulch chip module) |
Available upon quote |
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MSAP board |
Available upon quote |
Click on the part number for more information about each product
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About Company Handling This Product
- Japan