Ceramic package Gas sensor package/lid (semiconductor type)
Kyocera Corporation
About This Product
Semiconductor gas sensors, one of the main gas sensor methods, can detect flammable gases and poisonous gases, and have the advantage of long-term stability and high durability. With the advent of MEMS types in recent years, it has become possible to make gas sensors themselves smaller and thinner, creating a need for packages that can accommodate this change. Kyocera provides laminated ceramic packages that facilitate 3D wiring, supporting the development of small and thin gas sensors.
Features
■Small size and low profile
You can replace the pin insertion mounting of metal CAN packages with surface mount types that can be reflow-compatible. In addition, it has been made smaller and thinner by using 3D wiring. Furthermore, we can also propose designs that match the chip size you are using.
■Does not generate gas easily
Ceramic packages emit less gas and contribute to expanding the use of gas sensors in high-temperature environments. → Adoption results: VOC sensors installed in air conditioners/air purifiers, gas alarms, etc.
■Thermal expansion coefficient close to Si (silicon)
Because there is a difference in the coefficient of thermal expansion between Si, the element material, and the organic or metal package, there is a risk that thermal stress will occur during mounting and cause the mounted part to break. However, ceramics has a coefficient of thermal expansion similar to that of Si and is less likely to break even when heated, ensuring mounting reliability.
■High heat resistance
It has high heat resistance and is also used in automotive gas sensors.
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Product
Ceramic package Gas sensor package/lid (semiconductor type)
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Handling Company
Kyocera Corporation
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Categories
1 Models of Ceramic package Gas sensor package/lid (semiconductor type)
| Product Image | Part Number | Price (excluding tax) |
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Gas sensor package/lid (semiconductor type) |
Available upon quote |
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About Company Handling This Product
- Japan