Ceramic package SAW device package
Kyocera Corporation
About This Product
SAW devices are mainly installed in smartphones. Smartphones are becoming more sophisticated, the number of electronic devices they are equipped with is increasing, and they are required to be smaller and lower in profile. Kyocera's ceramic packages have excellent material properties and continue to be used in SAW devices by following size trends.
Features
■Low coefficient of thermal expansion
When heat is applied to a SAW device, the element deforms and its characteristics are adversely affected. Ceramics have a low coefficient of thermal expansion and suppress the deformation of elements due to heat, which can alleviate the effects on SAW device characteristics when temperature changes occur due to heat generation in surrounding components.
■Thinner
Kyocera's ceramic packages mass-produce ultra-low-profile substrates with a ceramic thickness of 0.1 mm, contributing to thinner devices.
■High thermal conductivity
Ceramic packages with high thermal conductivity can efficiently dissipate heat from elements.
■Hermetic sealing
Ceramic packages can also be used when hermetic sealing is required.
■High rigidity
Ceramic packages are less susceptible to deformation due to external pressure or heat, and can protect elements from the external environment.
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Product
Ceramic package SAW device package
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Handling Company
Kyocera Corporation
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Categories
1 Models of Ceramic package SAW device package
| Product Image | Part Number | Price (excluding tax) |
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Package for SAW device |
Available upon quote |
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About Company Handling This Product
- Japan