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Ceramic package SAW device package-Package for SAW device
Ceramic package SAW device package-Kyocera Corporation

Ceramic package SAW device package
Kyocera Corporation

Kyocera Corporation's Response Status

Response Rate

100.0%

Response Time

46.0hours


About This Product

SAW devices are mainly installed in smartphones. Smartphones are becoming more sophisticated, the number of electronic devices they are equipped with is increasing, and they are required to be smaller and lower in profile. Kyocera's ceramic packages have excellent material properties and continue to be used in SAW devices by following size trends. Features

■Low coefficient of thermal expansion

When heat is applied to a SAW device, the element deforms and its characteristics are adversely affected. Ceramics have a low coefficient of thermal expansion and suppress the deformation of elements due to heat, which can alleviate the effects on SAW device characteristics when temperature changes occur due to heat generation in surrounding components.

■Thinner

Kyocera's ceramic packages mass-produce ultra-low-profile substrates with a ceramic thickness of 0.1 mm, contributing to thinner devices.

■High thermal conductivity

Ceramic packages with high thermal conductivity can efficiently dissipate heat from elements.

■Hermetic sealing

Ceramic packages can also be used when hermetic sealing is required.

■High rigidity

Ceramic packages are less susceptible to deformation due to external pressure or heat, and can protect elements from the external environment.

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    Ceramic package SAW device package

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1 Models of Ceramic package SAW device package

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Ceramic package SAW device package-Part Number-Package for SAW device

Package for SAW device

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About Company Handling This Product

Response Rate

100.0%


Response Time

46.0hrs

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