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  4. Ceramic package Crystal device package/lid (Kyocera Corporation)
Ceramic package Crystal device package/lid-Package/lid for crystal devices
Ceramic package Crystal device package/lid-Kyocera Corporation

Ceramic package Crystal device package/lid
Kyocera Corporation

Kyocera Corporation's Response Status

Response Rate

100.0%

Response Time

46.0hours

About This Product

Packages for crystal devices must be highly airtight, and the market trend is for them to be smaller and lower in profile. Kyocera's ceramic packages have been used by customers for a long time due to continued improvements to achieve both miniaturization and high airtightness. We also offer ceramic lids for frit glass sealing, and you can purchase the package and lid as a set. Features

■Miniaturization

As devices become more sophisticated, the number of parts in crystal devices has increased, and as a result, they have become smaller. Kyocera continues to develop ultra-compact, low-profile packages that are ahead of such market demands. As a result, we are currently mass producing packages measuring 1.0 x 0.8 mm, one of the world's smallest classes, and are also developing even smaller products (0.8 x 0.6 mm).

■Hermetic sealing

Ceramic packages can be hermetically sealed. The selection of the sealing method is important to achieve airtight sealing. Typical sealing methods used for hermetic sealing are introduced below.

■Others

hollow structure

  • Product

    Ceramic package Crystal device package/lid

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1 Models of Ceramic package Crystal device package/lid

Image Part Number Price (excluding tax)
Ceramic package Crystal device package/lid-Part Number-Package/lid for crystal devices

Package/lid for crystal devices

Available upon quote

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About Company Handling This Product

Kyocera Corporation

Response Rate

100.0%

Response Time

46.0hrs

  • Japan

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Microelectronics & Semiconductor Packages
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