Wafer equipment Fully automatic ring cleaner RC-250 for labor saving when reusing ring frames
EARS Co., Ltd.
About This Product
■Summary
This is a fully automatic device that removes the dicing tape from the ring frame from which good chips have been removed, wipes the surface of the ring frame, cleans it, aligns the orientation, and stacks it in the collection area.
■Features
・After setting the cassette, turn on the switch and the process from tape removal to cleaning to storage is fully automated.
・Automatically performs phase adjustment, warp detection, and alignment of the ring frame.
- Optimal cleaning conditions can be set depending on the tape used.
- Store the removed dicing tape in a special box. Pull it out from the back of the device and dispose of it.
■Points
- Significant labor savings can be achieved by fully automatically performing tape removal work, which is an auxiliary work.
・Compared to manual work, the frequency of handling organic solvents is significantly reduced, which is effective in terms of safety and health.
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Product
Wafer equipment Fully automatic ring cleaner RC-250 for labor saving when reusing ring frames
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Handling Company
EARS Co., Ltd.
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Categories
1 Models of Wafer equipment Fully automatic ring cleaner RC-250 for labor saving when reusing ring frames
| Product Image | Part Number | Price (excluding tax) | Applicable tape | Applicable wiper | Cleaning liquid | Outer diameter dimension | Processing capacity (reference value) | Source | Tape frame | Target wafer size | Utility | Weight |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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RC-250 |
Available upon quote | UV tape | Benliese TS-100 roll type | IPA and MEK | Width 1,800 x Depth 1,100 x Height 2,140mm | Approximately 30 seconds/sheet | Three-phase AC200V | MODTF2-6-1 | Φ6 inch | Dry air (0.4MPa or more) | 750kg |
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About Company Handling This Product
- Japan