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  2. Non-contact dry cleaner for wafers (Hugle Electronics Co., Ltd.)
Non-contact dry cleaner for wafers-Non-contact dry cleaner for wafers
Non-contact dry cleaner for wafers-Hugle Electronics Co., Ltd.

Non-contact dry cleaner for wafers
Hugle Electronics Co., Ltd.

Hugle Electronics Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

51.6hours

About This Product

A non-contact dry cleaner that can be used for cleaning mounter tables (stages), before pasting dicing tape, BG tape, and protective films, after dicing, after dry scribing (breaking), after backgrinding, before inspection processes, etc. .

■Product overview

As IoT accelerates and permeates the world, demand for wafers, which serve as the base (substrate) for semiconductors installed in all electronic devices, is increasing. With the urgent need to expand wafer production, countermeasures against foreign matter and contamination that can cause defective products in the manufacturing process are an important issue in improving yield. Although wet methods are generally the mainstream method for removing dust from wafer surfaces, dry methods can be an extremely effective method for removing foreign matter in certain processes due to chip characteristics and cost-effectiveness. It is particularly effective in removing contaminants generated during the "cutting" and "shaving" processes, and just before the inspection process to identify defective products. Hugle Electronics' non-contact ultrasonic dry cleaner is a product that takes advantage of our company's strengths, having been involved in the semiconductor industry for half a century.

  • Product

    Non-contact dry cleaner for wafers

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1 Models of Non-contact dry cleaner for wafers

Image Part Number Price (excluding tax)
Non-contact dry cleaner for wafers-Part Number-Non-contact dry cleaner for wafers

Non-contact dry cleaner for wafers

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About Company Handling This Product

Hugle Electronics Co., Ltd.

Response Rate

100.0%

Response Time

51.6hrs

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