■Features
・Resist coating for 2 inch to 6 inch wafers
・Film thickness 0.8μm to 1μm (reference value)
・Spin rotation speed 50rpm to 6,000rpm (arbitrary setting)
・Rotary baking oven 50℃~200℃±1%
・Parallel processing in 2-track configuration
・Equipped with double arm transfer robot (equipped with 2 robots)
・Processing capacity approximately 80 sheets/h
・Customization possible
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