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About This Product

A metal ball whose core material is a Cu ball with excellent sphericity and size uniformity, and whose surface is plated with Pb-free solder.

■Features

The particle size of Cu balls can be selected from 80μm to 760μm. It has excellent strength and makes it possible to secure clearance for semiconductor packages. Plating thickness and composition are also diverse. ・Cu ball surface is smooth. ・Thick plating is possible. ・It is also possible to plate other than Cu balls.

  • Product

    Copper core ball

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0 Models of Copper core ball

Image Part Number Price (excluding tax) Manufacturing method Shape Main ingredients Plating composition Cu ball particle size

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Company Overview

FUKUDA METAL FOIL & POWDER CO., LTD. was established in 1935 and is a manufacturer and supplier of metal foils...

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