This product is registered by FUKUDA METAL FOIL & POWDER CO., LTD..
About This Product
Utilizing the electroplating technology cultivated through surface treatment of copper foil, we apply dissimilar metal plating to various types of metal foil, including copper. By applying plating, various properties such as decorativeness, rust prevention, and abrasion resistance can be added to metal foil.
■Base foil
Metal foil that serves as the base for plating. We can accommodate a variety of materials, widths, and thicknesses.
■Base foil standard material
・Copper: specific gravity 8.93
・Aluminum: specific gravity 2.70
・Nickel: specific gravity 8.90
■Variation
・Copper, nickel: Electrolytic foil, rolled foil, special foil (specific crystal orientation, high purity, ultra-low roughness)
・Aluminum: Pure aluminum (1,000 series), alloy type (Please contact us separately for compatible materials)
■Plating layer
This is a plating layer deposited on metal foil. The plating layer is applied by electroplating, so it boasts high thickness accuracy.
■Standard material for plating layer
・Tin: Melting point 232℃
・Nickel: Melting point 1,450℃
・Copper: Melting point 1,083℃
■Variation
・Single-sided plating: The base foil is exposed on the non-plated side.
・Pattern plating: Plating is applied only to the necessary areas.
■Features
Plated foil, which is a composite of different metals, brings new characteristics and possibilities to metal foil.
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