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General electrolytic copper foil HS/UN series
FUKUDA METAL FOIL & POWDER CO., LTD.

FUKUDA METAL FOIL & POWDER CO., LTD.'s Response Status

Response Rate

100.0%

Response Time

70.2hours


About This Product

A high-temperature, high-stretch foil for rigid boards that belongs to IPC Grade 3. UN achieves smooth resin flow by widening the nodule gap by sharpening the shape of the rough surface of the raw foil. HS with improved handling properties for thin films such as 12μm and 9μm. It can be used not only for the outer layer but also for the inner layer of CCL and BU boards.

■Features

This electrolytic copper foil has a wide range of applications and can be used on both the outer and inner layers of rigid boards.

  • Product

    General electrolytic copper foil HS/UN series

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0 Models of General electrolytic copper foil HS/UN series

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About Company Handling This Product

Response Rate

100.0%


Response Time

70.2hrs

Company Overview

FUKUDA METAL FOIL & POWDER CO., LTD. was established in 1935 and is a manufacturer and supplier of metal foils...

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