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Ultra-low roughness and high adhesion strength achieved by sub-micron fine roughening treatment Ultra-low roughness electrolytic copper foil CF-T4X-SV
FUKUDA METAL FOIL & POWDER CO., LTD.

FUKUDA METAL FOIL & POWDER CO., LTD.'s Response Status

Response Rate

100.0%

Response Time

70.2hours


About This Product

By applying "T4X" processing, which has a unique micro-roughening treatment shape, to the raw foil "SV", which features ultra-low roughness and double-sided gloss, a high anchoring effect is achieved despite the ultra-low roughness. It demonstrates high performance in a wide range of fields, from rigid PCBs where transmission characteristics and fine wire processing are important to FPCs where transparency is important.

■Roughening processing image

By applying the "T4X" process, which has a unique micro-roughening treatment shape, to the raw foil "SV", which features ultra-low roughness and double-sided gloss, it achieves a high anchoring effect despite its low roughness.

■Roughened surface SEM

This is a surface treatment with densely applied roughening particles that are much smaller than conventional spherical roughening. Features of ultra-fine roughening treatment “T4X”

■Ultra/low roughness rough surface

Submicron ultra-fine roughening treatment increases adhesion strength by increasing surface area without affecting roughness.

■High adhesion strength

Our unique micro-roughening treatment exhibits a high anchoring effect, achieving high adhesion strength despite low roughness.

■High base material transparency

Due to the ultra-fine surface topography, flexible substrates can achieve high transparency after etching.

■High circuit visibility

The black roughening treatment of T4X has a high color contrast with the base material, and the visibility of the back side of the circuit through the film base material is extremely high.

■No powder falling off

Despite being ultra-finely processed, it has high adhesion properties, so there is no powder falling and there is no need to worry about line contamination.

■Features

We have a rich lineup of thicknesses ranging from the thinnest 6μm to 35μm. We have achieved the lowest level of roughness among electrolytic copper foils that have undergone roughening treatment.

  • Product

    Ultra-low roughness and high adhesion strength achieved by sub-micron fine roughening treatment Ultra-low roughness electrolytic copper foil CF-T4X-SV

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0 Models of Ultra-low roughness and high adhesion strength achieved by sub-micron fine roughening treatment Ultra-low roughness electrolytic copper foil CF-T4X-SV

Image Part Number Price (excluding tax) Mass thickness (kg/㎡) Rough surface roughness (μm) Tensile strength at heat (N/㎟) Tensile strength normal (N/㎟) Tensile strength after heating (N/㎟) Shape Adhesion strength (FR-4) Normal state A (kN/m) Adhesion strength (FR-4) After hydrochloric acid treatment (%) Nominal thickness (μm) Elongation rate when heated (%) Growth rate normal (%) Elongation rate after heating (%) Main ingredients

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About Company Handling This Product

Response Rate

100.0%


Response Time

70.2hrs

Company Overview

FUKUDA METAL FOIL & POWDER CO., LTD. was established in 1935 and is a manufacturer and supplier of metal foils...

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