Research and development/prototype tabletop/manual/semi-automatic plating equipment-Tabletop wafer plating equipment

Research and development/prototype tabletop/manual/semi-automatic plating equipment-TEAM-FU：Semi-Automated Face-Up Plating Tool

Research and development/prototype tabletop/manual/semi-automatic plating equipment-TEMM-VT：Manual Vertical Dip Plating Tool

semi-automatic plating equipment
Toset Co., Ltd.

💻 Electronics & Electrical Use 🚀 Aerospace Industry Use 🚗 Automotive & Transport Use

About This Product

We will propose equipment that suits your application and budget, such as research and development of plating processes, prototyping of new products, and small-scale production.

We also support the individual design and production of plating equipment for research and development prototyping that corresponds to each of the four types of plating equipment for mass production.
We have multiple types of equipment in-house, and can perform demonstration evaluations to guarantee the performance of mass-produced equipment.

We receive many requests from our customers to install equipment similar to our own equipment in order to develop and prototype new products in-house.

After installing the equipment, we will provide as much support as possible regarding the plating process conditions based on our knowledge.

■Type of plating equipment for research and development/prototyping- Tabletop plating equipment (face-up type, vertical dip type)
- Face-up semi-automatic device (compatible with up to 12 inches)
- Vertical dip type manual device (compatible with 12 inch, □380mm board, negotiable for 380mm or more)

■Main plating film types- Cu wiring, electrodes (TSV, RDL, Cu pillar, etc.)
- Ni electrode, electroforming
- Solder microbumps such as SnAg, Indium, etc.
- Magnetic film (NiFe, FeCo, NiCo, NiCoFe, etc.)
- Noble metal film (Au, Ag, rhodium, etc.)

■Plating equipment that supports a wide range of plating processes for semiconductor and electronic device manufacturing.Based on the unique technology cultivated in the field of magnetic thin films for HDDs, which require high quality, in recent years we have been working in the field of small electronic components installed in mobile terminal devices such as smartphones and tablets, as well as in the semiconductor packaging, MEMS, and sensor fields. It is widely used in plating applications.

Model
There are 4 models for this product.

Product
Research and development/prototype tabletop/manual/semi-automatic plating equipment

Handling Company
Toset Co., Ltd.

Categories

Semiconductor Manufacturing

Semiconductor Manufacturing Equipment Component & Part Machining

Usage Scenarios
Electronics & Electrical Use / Aerospace Industry Use / Automotive & Transport Use

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4 Models of Research and development/prototype tabletop/manual/semi-automatic plating equipment

Click on the part number for more information about each product

Part Number	Price (excluding tax)	Method	Panel size	Wafer size	Plating material
Tabletop wafer plating equipment	Available upon quote	Face-up type/vertical dip type	~300mm / more	Max.300mm	Cu, Au, Ni, Sn, SnAg, magnetic film, etc.
TEAM-FU：Semi-Automated Face-Up Plating Tool	Available upon quote	Face up type	N/A	Max. 300mm	Magnetic film, Cu, Ni, Au, etc.
TEMM-VT：Manual Vertical Dip Plating Tool	Available upon quote	Vertical dip type	~300mm / more	Max. 300mm	Cu, Ni, Au, etc.
TEAM-FU : Semi-Automated Face-Up Plating Tool	Available upon quote	Face up type	N/A	Max. 300mm	Magnetic film, Cu, Ni, Au, etc.

Click on the part number for more information about each product

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About Company Handling This Product

Toset Co., Ltd.

Japan

Related search keywords

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Research and development/prototype tabletop/manual/semi-automatic plating equipment Toset Co., Ltd.

About This Product

■Type of plating equipment for research and development/prototyping

■Main plating film types

■Plating equipment that supports a wide range of plating processes for semiconductor and electronic device manufacturing.

4 Models of Research and development/prototype tabletop/manual/semi-automatic plating equipment

Tabletop wafer plating equipment

TEAM-FU：Semi-Automated Face-Up Plating Tool

TEMM-VT：Manual Vertical Dip Plating Tool

TEAM-FU : Semi-Automated Face-Up Plating Tool

Customers who viewed this product also viewed

Other products of Toset Co., Ltd.

About Company Handling This Product

Related search keywords

Research and development/prototype tabletop/manual/semi-automatic plating equipment
Toset Co., Ltd.