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  4. Semi-automatic vertical dip type wafer/panel plating equipment TESM-VT (Toset Co., Ltd.)
Semi-automatic vertical dip type wafer/panel plating equipment TESM-VT-TESM-VT : Semi-Automated Vertical Dip Plating Tool (Wafer)
Semi-automatic vertical dip type wafer/panel plating equipment TESM-VT-TESM-VT：Semi-Automated Vertical Dip Plating Tool (Panel)
Semi-automatic vertical dip type wafer/panel plating equipment TESM-VT-Toset Co., Ltd.

Semi-automatic vertical dip type wafer/panel plating equipment TESM-VT
Toset Co., Ltd.

💻 Electronics & Electrical Use 🚀 Aerospace Industry Use 🚗 Automotive & Transport Use

About This Product

A semi-automatic type vertical machine that manually attaches workpieces such as wafers, resin, glass, and ceramic substrates to rack jigs, sets the jigs on the loader, and then automatically carries out pretreatment, plating, washing, and drying processes using a robot. This is a mold dip type electrolytic plating device. It is widely used for plating small electronic components installed in mobile terminal devices such as smartphones and tablets.

■ Features of semi-automatic vertical dip plating equipment

・It is possible to design and manufacture any number of plating tanks according to process requirements such as plating film type and film thickness. ・Can also be used for double-sided plating ・Individual jigs can be designed for fragile board materials and different board thicknesses. ・Stable film thickness distribution can be obtained by fine adjustment of the paddle stirring mechanism and shielding plate. ・Mixed flow of different workpiece sizes is possible ・The device configuration is simple and there are fewer transportation troubles because the work is manually attached to and detached from the jig. ・Initial investment is low compared to fully automatic machines

■ Plating process

・Cu ・Ni ・Ni/St-Au/Au laminated plating

  • Product

    Semi-automatic vertical dip type wafer/panel plating equipment TESM-VT

  • Usage Scenarios

    Electronics & Electrical Use / Aerospace Industry Use / Automotive & Transport Use

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2 Models of Semi-automatic vertical dip type wafer/panel plating equipment TESM-VT

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Image Part Number Price (excluding tax) Method Panel size Wafer size Plating material
Semi-automatic vertical dip type wafer/panel plating equipment TESM-VT-Part Number-TESM-VT : Semi-Automated Vertical Dip Plating Tool (Wafer)

TESM-VT : Semi-Automated Vertical Dip Plating Tool (Wafer)

Available upon quote

Vertical dip type

N/A

Max. 300mm

Cu, Ni, Au, etc.

Semi-automatic vertical dip type wafer/panel plating equipment TESM-VT-Part Number-TESM-VT：Semi-Automated Vertical Dip Plating Tool (Panel)

TESM-VT：Semi-Automated Vertical Dip Plating Tool (Panel)

Available upon quote

Vertical dip

~380mm / more

N/A

Cu, Ni, Au, etc.

Click on the part number for more information about each product

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About Company Handling This Product

Toset Co., Ltd.

  • Japan

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Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　Toset Co., Ltd.
Toset Co., Ltd.

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