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  4. Fully automatic face-down type wafer plating equipment TEAM-FD (Toset Co., Ltd.)
Fully automatic face-down type wafer plating equipment TEAM-FD-TEAM-FD : Automated Face-down Plating Tool
Fully automatic face-down type wafer plating equipment TEAM-FD-Toset Co., Ltd.

Fully automatic face-down type wafer plating equipment TEAM-FD
Toset Co., Ltd.

💻 Electronics & Electrical Use 🚀 Aerospace Industry Use 🚗 Automotive & Transport Use

About This Product

Fully automatic cassette-to-cassette transfer type face-down type (cup jet type) electrolytic plating equipment. After loading the wafer cassette into the loader, the transfer robot performs all processes including pretreatment, plating, washing, and drying. It is widely used for forming electrodes on small electronic components installed in mobile devices such as smartphones and tablets.

■ Features of semi-automatic vertical dip plating equipment

・It is possible to design and manufacture any number of plating tanks according to process requirements such as plating film type and film thickness. ・Individual support for substrate materials that are easy to break

■ Plating process

・Cu ・Ni ・Ni/St-Au/Au laminated plating

  • Product

    Fully automatic face-down type wafer plating equipment TEAM-FD

  • Usage Scenarios

    Electronics & Electrical Use / Aerospace Industry Use / Automotive & Transport Use

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1 Models of Fully automatic face-down type wafer plating equipment TEAM-FD

Image Part Number Price (excluding tax) Method Panel size Wafer size Plating material
Fully automatic face-down type wafer plating equipment TEAM-FD-Part Number-TEAM-FD : Automated Face-down Plating Tool

TEAM-FD : Automated Face-down Plating Tool

Available upon quote

Face down type

N/A

Max. 200mm

Cu, Ni, Ni/St-Au /Au multilayer plating

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About Company Handling This Product

Toset Co., Ltd.

  • Japan

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Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　Toset Co., Ltd.
Toset Co., Ltd.

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