Fully automatic face-up type wafer plating equipment TEAM-FU-TEAM-FU : Automated Face-up Plating Tool

Fully automatic face-up type wafer plating equipment TEAM-FU
Toset Co., Ltd.

🚀 Aerospace Industry Use 💻 Electronics & Electrical Use

About This Product

■We have a track record of delivering magnetic film plating equipment to all companies in the HDD industry.The face-up method has been used for 30 years in the magnetic thin film formation process for HDD magnetic heads.
Based on the unique technology cultivated in this field, in addition to magnetic thin film formation processes such as magnetic sensors, small electronic components installed in mobile terminal devices such as smartphones and tablets, electrodes and wiring formation in the semiconductor and MEMS fields. It is widely used in.

Because of its excellent in-plane film thickness uniformity, it is also used in advanced packaging such as TSV and RDL, as well as in the electrode and wiring formation processes of three-dimensional integrated devices.

■Features of face-up plating equipment●Good film thickness uniformity within the wafer surface
●Excellent alloy composition stability
●Can be used with highly corrosive plating films
●The number of tanks can be increased or decreased depending on the process and throughput.
●Easy to transport cassettes to cassettes

■Plating typeMagnetic materials, copper, nickel, gold, etc.

■Target work4, 6, 8, 12 inch size silicone, compound, glass, etc.

■Applications●Magnetic thin film for HDD magnetic heads and magnetic sensors (NiFe, FeCo, NiFeCo)
●Electrode and wiring formation processes such as TSV, RDL, and micro bumps in the advanced packaging field

Model
There are 1 models for this product.

Product
Fully automatic face-up type wafer plating equipment TEAM-FU

Handling Company
Toset Co., Ltd.

Categories

Semiconductor Manufacturing

Semiconductor Manufacturing Equipment Component & Part Machining

Usage Scenarios
Aerospace Industry Use / Electronics & Electrical Use

340+ people viewing

Last viewed: 19 hours ago

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1 Models of Fully automatic face-up type wafer plating equipment TEAM-FU

Image	Part Number	Price (excluding tax)	Method	Panel size	Wafer size	Plating material
	TEAM-FU : Automated Face-up Plating Tool	Available upon quote	Face up type		Max. 300mm	Magnetic materials, TSV, Cu filling, Cu, Au, Ni, etc.

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About Company Handling This Product

Toset Co., Ltd.

Japan

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Fully automatic face-up type wafer plating equipment TEAM-FU Toset Co., Ltd.

About This Product

■We have a track record of delivering magnetic film plating equipment to all companies in the HDD industry.

■Features of face-up plating equipment

■Plating type

■Target work

■Applications

1 Models of Fully automatic face-up type wafer plating equipment TEAM-FU

TEAM-FU : Automated Face-up Plating Tool

Customers who viewed this product also viewed

Other products of Toset Co., Ltd.

About Company Handling This Product

Related search keywords

Fully automatic face-up type wafer plating equipment TEAM-FU
Toset Co., Ltd.