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  4. any layer board (Meiko Co., Ltd.)
any layer board-Any layer board
any layer board-Meiko Co., Ltd.

any layer board
Meiko Co., Ltd.

About This Product

This is a board with free connections on all layers, combining laser technology that allows ultra-fine processing and filled plating technology. Because it has a high degree of freedom in design and can achieve high density, it is the perfect substrate for the needs of smaller and thinner high-performance devices such as smartphones. Meiko is currently developing the MSAP method for even finer wiring.

■Characteristics of Anylayer board

・Higher density and thinner design with full-layer laser via connection ・Compatible with 0.4mm pitch CSP

■Main uses

・Smartphone ・Communication module ・IoT/AI home appliances ・Digital camera

  • Product

    any layer board

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1 Models of any layer board

Image Part Number Price (excluding tax)
any layer board-Part Number-Any layer board

Any layer board

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About Company Handling This Product

Meiko Co., Ltd.

  • Japan

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