any layer board
Meiko Co., Ltd.
About This Product
This is a board with free connections on all layers, combining laser technology that allows ultra-fine processing and filled plating technology. Because it has a high degree of freedom in design and can achieve high density, it is the perfect substrate for the needs of smaller and thinner high-performance devices such as smartphones. Meiko is currently developing the MSAP method for even finer wiring.
■Characteristics of Anylayer board
・Higher density and thinner design with full-layer laser via connection
・Compatible with 0.4mm pitch CSP
■Main uses
・Smartphone
・Communication module
・IoT/AI home appliances
・Digital camera
-
Product
any layer board
-
Handling Company
Meiko Co., Ltd.
-
Categories
1 Models of any layer board
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
|
|
Any layer board |
Available upon quote |
Customers who viewed this product also viewed
Other products of Meiko Co., Ltd.
View more products of Meiko Co., Ltd.
About Company Handling This Product
- Japan