semiconductor package substrate
Meiko Co., Ltd.
About This Product
Semiconductor package substrates are microscopic substrates that serve as external connection terminals when semiconductors (IC chips) are mounted on printed circuit boards. In order to form fine circuits, Meiko uses the MSAP method and SAP method in addition to the Subtra method, and is also capable of forming patterns with L/S=10/10μm. We have a proven track record for semiconductor memory and CPUs, and we are expanding our manufacturing capacity and conducting research and development in Japan and overseas.
■Characteristics of semiconductor package substrates
・Introduction of MSAP method and SAP method for forming ultra-fine circuits
・Also compatible with special material ABF material
・Introduction of coreless construction method that supports thinning
■Main uses
·car
・IoT, AI
・PC
・Communication module
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Product
semiconductor package substrate
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Handling Company
Meiko Co., Ltd.
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Categories
1 Models of semiconductor package substrate
| Product Image | Part Number | Price (excluding tax) |
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Semiconductor package substrate |
Available upon quote |
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About Company Handling This Product
- Japan