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  2. Electronic device laminator Vacuum diaphragm laminator with flattening stage (2 stages) MVLP500/600-ⅡW (The Japan Steel Works, LTD.)
Electronic device laminator Vacuum diaphragm laminator with flattening stage (2 stages) MVLP500/600-ⅡW-MVLP500/600-ⅡW
Electronic device laminator Vacuum diaphragm laminator with flattening stage (2 stages) MVLP500/600-ⅡW-The Japan Steel Works, LTD.

Electronic device laminator Vacuum diaphragm laminator with flattening stage (2 stages) MVLP500/600-ⅡW
The Japan Steel Works, LTD.

About This Product

This is a device that applies a film uniformly to the entire surface of a product under vacuum. By inflating a soft rubber diaphragm, it is possible to achieve optimal bonding with high followability and adhesion. When you hear the word laminator, you probably think of a laminator that is used to make bookmarks from pressed flowers, for example. Our laminator is basically a device that does the same thing. The same thing applies to "heat" and "pressure". The major difference is that a vacuum is created before that, and then pressure is applied using a soft rubber sheet called a diaphragm. This device removes the air between the items to be laminated, inflates a soft rubber sheet like a balloon and presses it against each other, and uses its elasticity and air pressure to achieve optimal lamination with high conformability and adhesion.

■Features

-Diaphragm method with excellent followability. ・Maximum pressurization of diaphragm is 1.0MPa - Can be heated from above and below under vacuum. - Maintains high vacuum with special vacuum chamber structure. ・The lineup includes a 1-stage type with laminating function, a 2-stage type with flattening function, and a 3-stage type for high-end package substrates. - Compatible with the following materials. Photosensitive coverlay film, solder resist film, interlayer insulation film, various insulation films, sealing sheets, etc.

■Vacuum and pressure process

・The vacuum chamber consists of upper and lower heating plates, each with a built-in heater. - When the product is placed in the hot plate, the hot plate is closed (chamber formation) and the inside is evacuated. - When the set time has elapsed, compressed air is supplied and the diaphragm expands, pressing the product against the hot plate. This pressing force and heat performs crimping.

■Vacuum lamination technology

Vacuum lamination technology has become indispensable in the field of semiconductor manufacturing. We will provide advice based on our many years of know-how and experience, and also cooperate in new product development.

■Applications

package substrate etc.

  • Product

    Electronic device laminator Vacuum diaphragm laminator with flattening stage (2 stages) MVLP500/600-ⅡW

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1 Models of Electronic device laminator Vacuum diaphragm laminator with flattening stage (2 stages) MVLP500/600-ⅡW

Image Part Number Price (excluding tax) 2nd stage Maximum molding temperature (℃) 2nd stage maximum molding pressure (MPa) 2nd stage molding dimensions (mm) 1st stage Maximum molding temperature (℃) 1st stage maximum molding pressure (MPa) 1st stage molding dimensions (mm) 1st stage ultimate vacuum (hPa)
Electronic device laminator Vacuum diaphragm laminator with flattening stage (2 stages) MVLP500/600-ⅡW-Part Number-MVLP500/600-ⅡW

MVLP500/600-ⅡW

Available upon quote

150

2

520×620×t3

180

1

520×620×t3

4 or less

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About Company Handling This Product

The Japan Steel Works, LTD.

Company Overview

The Japan Steel Works, LTD., founded in Tokyo, Japan, in 1907 is a manufacturer of plastic machinery products ...

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