High heat dissipation board/aluminum base board
Shirai Electronics Industry Co., Ltd.
About This Product
■Features
・Protects components from thermal damage with high thermal conductivity and heat dissipation properties. (Base material nominal heat dissipation characteristics: 3.0W/m・K~)
・High tracking resistance provides electrical fire safety. (CTI value: 600V or more)
・It has high withstand voltage characteristics and can be used with confidence. (Through withstand voltage: 3.0kV/100μm)
・UL certified (2012.06 obtained)
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Product
High heat dissipation board/aluminum base board
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Handling Company
Shirai Electronics Industry Co., Ltd.
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Categories
1 Models of High heat dissipation board/aluminum base board
| Product Image | Part Number | Price (excluding tax) | Base aluminum thickness | Insulation layer thickness | Others | Surface copper foil thickness | Surface insulation treatment specifications | Surface treatment specifications |
|---|---|---|---|---|---|---|---|---|
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High heat dissipation board/aluminum base board |
Available upon quote |
0.6, 1.0, 1.5, 2.0 (mm) (1.0 (mm) thickness, AL-Mg type A5052 as standard) |
80, 100, 120 (μm) (Uses epoxy resin containing heat dissipation filler. Standard is 100 (μm)) |
Non-through hole specification (The circuit is only on the surface copper surface, and does not support front and back conduction.) |
35, 70 (μm) (35 (μm) thickness as standard) |
Liquid photoresist, thermosetting resist (In addition to regular green, high-gloss white and matte black are also available) |
OSP (Pbf-HAL, electroless Ni-Au) OSP as standard. (Please consult us separately for Pbf-HAL and electroless Ni-Au) |
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