Product
Transparent flexible substrate seriesHandling Company
Shirai Electronics Industry Co., Ltd.Categories
Product Image | Part Number | Price (excluding tax) | Base material name | Base material thickness | Chemical resistance (HCl (35%) 5min) | Copper foil | Copper foil peel strength (50mm/min) | Dielectric breakdown voltage (withstand voltage tester in oil) | Dissipation factor (1MHz) (mutual induction bridge method) | Flame retardant (UL94) | Humidity resistance (40℃/85%/96H/100V) | Insulation thickness | Migration resistance test | Pitch | Reflow heat resistance (180℃) (low temperature soldering 180℃) | Relative permittivity (1MHz) (mutual induction bridge method) | Surface insulation resistance (applied voltage 100V/1min) | Surface withstand voltage (applied voltage 500V/1min) | Temperature cycle test | Volume insulation resistance (withstand voltage tester in oil) | Wiring width |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SPET-MM |
Available upon quote | PET | 100μm・188μm | No abnormality | 12μm・12μm, 18μm | 1N/mm or more | 20KV (thickness 50μm) | 0.02 | VTM-2 equivalent | 1GΩ or more | 15μm |
No abnormality (85℃, 85%RH 500h) |
Min100μm | No lifting of copper foil | 3.67 | 1GΩ or more | No flashover |
No abnormality (-65℃/20min⇔125℃/20min) |
1E+12Ω・cm | 15μm・15μm, 25μm |