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  4. Burn-in equipment (for devices, chips, and elements) (Semi Next Co., Ltd.)
Burn-in equipment (for devices, chips, and elements)-Burn-in equipment (for devices, chips, and elements)
Burn-in equipment (for devices, chips, and elements)-Semi Next Co., Ltd.

Burn-in equipment (for devices, chips, and elements)
Semi Next Co., Ltd.

About This Product

■Significantly improved production efficiency. Burn-in conditions can be set freely for each jig, making it convenient for research and development.

Our ``burn-in device'' is not a chamber type, but it is an easy-to-use facility that allows you to control the temperature and power conditions for each jig.

■Features

・Simultaneous burn-in of up to 4224pcs devices in one system ・Temperature and power conditions can be controlled for each jig ・Dedicated jigs support wire bonding, loader, burn-in, unloader, and inspection.

  • Product

    Burn-in equipment (for devices, chips, and elements)

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1 Models of Burn-in equipment (for devices, chips, and elements)

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Burn-in equipment (for devices, chips, and elements)-Part Number-Burn-in equipment (for devices, chips, and elements)

Burn-in equipment (for devices, chips, and elements)

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About Company Handling This Product

Semi Next Co., Ltd.

  • Japan

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Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　Semi Next Co., Ltd.
Semi Next Co., Ltd.

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