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Non-silicone heat conductive putty + dispenser-WW-TGN8000DI
Non-silicone heat conductive putty + dispenser-Widework Co., Ltd.

Non-silicone heat conductive putty + dispenser
Widework Co., Ltd.


About This Product

■Specifications

・Insulation ・RoHS compliant product

■Features

・Silicone-free (does not use silicone-based materials), so no low-molecular-weight siloxane is generated and there are no problems such as electrical contact failure. ・Used to fill the gap between the heating element and heat dissipation parts. - Excellent adhesion to uneven and curved surfaces, demonstrating highly reliable heat conduction. ・It is a paste-like (processed into a fluid semi-solid) thermal conductive material, and is a thermal interface material with a hardness between that of thermal conductive grease and thermal conductive sheet. - Due to its high viscosity, it can be applied vertically without dripping. ・Since it is clay-like, it can be attached more closely to each component than conventional heat conductive sheets. - No need to worry about pumping out. ・This is a set product that includes heat conductive putty and a dispenser.

■Applications

・Heat measures for heat-generating parts of electronic and electrical equipment. - Heat dissipation measures for CPU, IC, LED, etc. ・Heat countermeasures for power ICs. Heat countermeasures for power supplies. - Heat radiation measures for all heating elements.

  • Product

    Non-silicone heat conductive putty + dispenser

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1 Models of Non-silicone heat conductive putty + dispenser

Image Part Number Price (excluding tax) Color Viscosity Thermal conductivity Density Capacity Operating temperature range Volume resistance value JAN
Non-silicone heat conductive putty + dispenser-Part Number-WW-TGN8000DI

WW-TGN8000DI

Available upon quote

Yellow

430Pa・s

8.0W/m・K (based on ASTM D5470)

3g/cm3

30ml

-40℃~125℃

>10^10 ohm-m

4524945013513

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