Dicing peripheral equipment Semi-auto tape mounter SMM-100
EARS Co., Ltd.
About This Product
■Summary
This device semi-automatically attaches the wafer and dicing tape to the tape frame with high precision.
It's a device.
■Features
・Can attach wafer to tape without bubbles
・The table can be heated to apply the appropriate temperature to the wafer.
-Equipped with an ionizer to prevent static electricity on the tape.
・Tape and wafer pasting is performed automatically at the set speed.
・Wafer thickness can be adjusted by adjusting the table height above or below.
・Rings other than the specified tape frame can be replaced by replacing the set plate (optional)
■Points
It is also possible to attach IC boards (complete with mold).
■Workflow
1. Set the tape frame (positioning pin abutment & magnet fixation)
2. Set the wafer (alignment)
3. Turn on the wafer suction fixing switch
4. Manually pull out the dicing tape and set it in place
5. Set the pasting roller in place and turn on the start switch with both hands.
6.The pasting roller automatically reciprocates. After stopping, close the cover manually.
7. Perform circle cut & pitch cut manually
8. Open the cover, cut the tape and remove the white part.
9. Turn off the wafer suction switch, remove the workpiece, and you're done.
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Product
Dicing peripheral equipment Semi-auto tape mounter SMM-100
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Handling Company
EARS Co., Ltd.
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Categories
1 Models of Dicing peripheral equipment Semi-auto tape mounter SMM-100
| Product Image | Part Number | Price (excluding tax) | Applicable tape dimensions | Applicable wafer | Depth | Height | Pasting speed | Source | Table heating temperature | Tape frame | Utility | Weight | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SMM-100 |
Available upon quote | Width: 300mm, core diameter: φ75, winding diameter: Max φ200 | Φ8 inch or less | 800mm | 500mm | 1~20mm/Sec | AC100V 20A | RT~80℃ | MODTF2-8-1 | Dry air (0.4MPa or more) / Factory vacuum | 70kg | 650mm |
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About Company Handling This Product
- Japan