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  2. Bluetooth® Low Energy Module HY0020 (FDK Co., Ltd.)
Bluetooth® Low Energy Module HY0020-HY0020
Bluetooth® Low Energy Module HY0020-FDK Co., Ltd.

Bluetooth® Low Energy Module HY0020
FDK Co., Ltd.

About This Product

We deliver small, high-performance wireless modules based on our unique small shield resin printing technology and extensive knowledge.

■Bluetooth® Low Energy module using SASP® technology

・Since the mounting board occupies a small area, it can be installed in small devices. ・Easy to create devices with high wiring flexibility and high design quality ・Wireless development know-how is not required as it comes with an antenna and is scheduled for wireless certification. Features

■Slot Antenna on Shielded Package

・Ultra small module with antenna placed on the shield - No need for large areas where wiring is prohibited. ＿World's smallest mounting board footprint ・Bluetooth v5.3 ・Low energy 2Mbps ・Bluetooth mesh ・Maximum output: +4dBm ・Sensitivity: -94dBm (1Mbps)

■Chip: Nordic nRF52832

・Arm® Cortex®-M4 32-bit processor with FPU, 64MHz ・512kB Flash / 64kB RAM

■12-bit 200ksps ADC

Built-in 32MHz, 32.768kHz crystal oscillator

■Built-in LDO, DC/DC circuit

Lead-free, RoHS compliant

■Authentication

・Bluetooth SIG ・Construction design certification ・FCC ・ISED ・CE EN300 328

■Applications

Wearables, Healthcare, Remote Control, IoT, Beacons, Computer Peripherals

■Evaluation board

An evaluation board equipped with HY0020 is also available. Please use it for checking module characteristics and software development.

  • Product

    Bluetooth® Low Energy Module HY0020

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1 Models of Bluetooth® Low Energy Module HY0020

Image Part Number Price (excluding tax) Power supply voltage External shape Operating temperature Digital I/F
Bluetooth® Low Energy Module HY0020-Part Number-HY0020

HY0020

Available upon quote

1.7V~3.6V

3.5 x 10 x 1.0mm

-40℃~+85℃

NFC, SPI, I2C, I2S, UART, PDM, QDEC

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About Company Handling This Product

FDK Co., Ltd.

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