Polyimide/PI materials
CHEMFISH TOKYO Co., Ltd.
About This Product
■Summary
Polyimide, which is used as an insulating base material for electronic circuit materials, is a general term for polymer compounds containing imide (-CO-NR-CO-) bonds. It has extremely high mechanical strength, excellent heat resistance, electrical insulation, and excellent chemical resistance. Furthermore, its coefficient of thermal expansion is low compared to organic materials, and even when used at high temperatures, there is little error due to expansion, so it is widely used in industrial products. We sell over 100 types of polyimide materials.
■Chemical structure of polyimide
Aromatic polyimides, in which R and R' are aromatic, are commonly used.
■Generation of polyimide
Make polyamic acid from diamine + carboxylic acid anhydride (R-CO-O-CO-R’). It is heated to over 200 degrees and imidized to obtain polyimide.
■Practical trends in polyimide
As a special engineering material, polyimide is widely applied in fields such as aviation, space, microelectronics, nanotechnology, liquid crystals, separation membranes, and lasers. Polyimide films are widely used as flexible printed circuit boards for office automation equipment and cameras, interlayer insulation for electric wires, and protective films for semiconductors.
It is also used as a coating agent to maintain the insulation of conductive wires in mobile phones and computers. The heat resistance of polyimide is used because the insulator that coats conductors bonded using solder must be heat resistant.
*Other model numbers are available.
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Product
Polyimide/PI materials
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Handling Company
CHEMFISH TOKYO Co., Ltd.
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Categories
10 Models of Polyimide/PI materials
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | CAS | English name |
|---|---|---|---|---|
Bis(3-amino-4-hydroxyphenyl) sulfone |
Available upon quote | 7545-50-8 | Bis (3-amino-4-hydroxyphenyl) Sulfone; 3,3'-Diamino-4,4'-dihydroxydiphenylsulfone | |
2,2'-bis(trifluoromethyl)benzidine |
Available upon quote | 341-58-2 | 2,2'-BIS (TRIFLUOROMETHYL) BENZIDINE 2,2'-bis (trifluoromethyl) benzidine (TFMB) / (TFDB) | |
2,2-bis[4- (4-aminophenoxy)phenyl]hexafluoropropane |
Available upon quote | 69563-88-8 | 2,2-Bis[4- (4-aminophenoxy) phenyl]-hexafluoropropanane (HFBAPP) | |
4,4'-oxybis[3-(trifluoromethyl)aniline] |
Available upon quote | 344-48-9 | 2,2'-Bis (trifluoromethyl) -4,4'-diaminodiphenyl ether (6FODA) | |
3,4'-Oxydiphthalic anhydride |
Available upon quote | 50662-95-8 | 2,3,3',4'-Tetracarboxydiphenyl oxide dianhydride (α-ODPA) | |
4,4'-Oxydiphthalic anhydride |
Available upon quote | 1823-59-2 | 4,4'-Oxydiphthalic anhydride | |
1,1'-biphenyl-2,3,3',4'-tetracarboxylic acid 2,3:3',4'-dianhydride |
Available upon quote | 36978-41-3 | 2,3,3',4'-BiphenyLtetracarboxylic (α-BPDA) | |
9,9-bis(4-aminophenyl)fluorene |
Available upon quote | 15499-84-0 | 9,9-Bis(4-aminophenyl)fluorene (FDA) | |
9,9-bis(4-amino-3-fluorophenyl) fluorene |
Available upon quote | 127926-65-2 | 9,9-Bis (3-fluoro-4-aminophenyl) fluorene (FFDA) | |
3,5-diaminobenzoic acid |
Available upon quote | 535-87-5 | 3,5-Diaminobenzoic acid (DABA) |
Click on the part number for more information about each product
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