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Polyimide/PI materials
CHEMFISH TOKYO Co., Ltd.

CHEMFISH TOKYO Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

91.5hours


About This Product

■Summary

Polyimide, which is used as an insulating base material for electronic circuit materials, is a general term for polymer compounds containing imide (-CO-NR-CO-) bonds. It has extremely high mechanical strength, excellent heat resistance, electrical insulation, and excellent chemical resistance. Furthermore, its coefficient of thermal expansion is low compared to organic materials, and even when used at high temperatures, there is little error due to expansion, so it is widely used in industrial products. We sell over 100 types of polyimide materials.

■Chemical structure of polyimide

Aromatic polyimides, in which R and R' are aromatic, are commonly used.

■Generation of polyimide

Make polyamic acid from diamine + carboxylic acid anhydride (R-CO-O-CO-R’). It is heated to over 200 degrees and imidized to obtain polyimide.

■Practical trends in polyimide

As a special engineering material, polyimide is widely applied in fields such as aviation, space, microelectronics, nanotechnology, liquid crystals, separation membranes, and lasers. Polyimide films are widely used as flexible printed circuit boards for office automation equipment and cameras, interlayer insulation for electric wires, and protective films for semiconductors. It is also used as a coating agent to maintain the insulation of conductive wires in mobile phones and computers. The heat resistance of polyimide is used because the insulator that coats conductors bonded using solder must be heat resistant. *Other model numbers are available.

  • Product

    Polyimide/PI materials

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10 Models of Polyimide/PI materials

Click on the part number for more information about each product

Image Part Number Price (excluding tax) English name CAS

Bis(3-amino-4-hydroxyphenyl) sulfone

Available upon quote

Bis (3-amino-4-hydroxyphenyl) Sulfone; 3,3'-Diamino-4,4'-dihydroxydiphenylsulfone

7545-50-8

2,2'-bis(trifluoromethyl)benzidine

Available upon quote

2,2'-BIS (TRIFLUOROMETHYL) BENZIDINE 2,2'-bis (trifluoromethyl) benzidine (TFMB) / (TFDB)

341-58-2

2,2-bis[4- (4-aminophenoxy)phenyl]hexafluoropropane

Available upon quote

2,2-Bis[4- (4-aminophenoxy) phenyl]-hexafluoropropanane (HFBAPP)

69563-88-8

4,4'-oxybis[3-(trifluoromethyl)aniline]

Available upon quote

2,2'-Bis (trifluoromethyl) -4,4'-diaminodiphenyl ether (6FODA)

344-48-9

3,4'-Oxydiphthalic anhydride

Available upon quote

2,3,3',4'-Tetracarboxydiphenyl oxide dianhydride (α-ODPA)

50662-95-8

4,4'-Oxydiphthalic anhydride

Available upon quote

4,4'-Oxydiphthalic anhydride

1823-59-2

1,1'-biphenyl-2,3,3',4'-tetracarboxylic acid 2,3:3',4'-dianhydride

Available upon quote

2,3,3',4'-BiphenyLtetracarboxylic (α-BPDA)

36978-41-3

9,9-bis(4-aminophenyl)fluorene

Available upon quote

9,9-Bis(4-aminophenyl)fluorene (FDA)

15499-84-0

9,9-bis(4-amino-3-fluorophenyl) fluorene

Available upon quote

9,9-Bis (3-fluoro-4-aminophenyl) fluorene (FFDA)

127926-65-2

3,5-diaminobenzoic acid

Available upon quote

3,5-Diaminobenzoic acid (DABA)

535-87-5

Click on the part number for more information about each product

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About Company Handling This Product

Response Rate

100.0%


Response Time

91.5hrs

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