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  3. Silicon Wafers
  4. TSV Wafer (Icemos Technology Japan Co., Ltd.)
TSV Wafer-TSV Wafer Wafer diameter 100mm
TSV Wafer-Icemos Technology Japan Co., Ltd.

TSV Wafer
Icemos Technology Japan Co., Ltd.

About This Product

The development of innovative and powerful internal wafer conduction technology provides a means to solve design-related packaging issues such as IC and MEMS. Internal conduction solutions facilitate design and wafer-level packaging including solder bump contacts. We apply a process to the board in advance and deliver it with conductive parts formed within the board. Ideal for foundations such as CMOS. The internal conduction points are filled with doped polysilicon by etching the wafer. The wafer maintains surface metal contamination standards and flatness, and particles are of a grade that meets industry standards. Stable substrate performance has been confirmed even when exposed to a 1200℃ diffusion process. We will partner with you to develop an internal conduction solution that meets your specifications and create the desired internal conduction pattern for your circuit or sensor. There will be bonding pads on the sides and bottom, but the design will be optimized and customized to meet your requirements.

■Application

・SOI solution for MEMS/MST ・Microfluidics/flow sensor ・RF MEMS ・Optoelectronics ・Smart power ・Advanced analog ICs

■Final market

・Telecommunications ·medical care ·car ・For general consumers ·musical instrument

  • Product

    TSV Wafer

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2 Models of TSV Wafer

Click on the part number for more information about each product

Image Part Number Price (excluding tax) Isolation resistance value Oxide film thickness Minimum pitch Maximum diameter Poly resistivity Wafer thickness
TSV Wafer-Part Number-TSV Wafer Wafer diameter 100mm

TSV Wafer Wafer diameter 100mm

Available upon quote

By oxide liner (addiction by design)

0.2-2μm

90μm (3 times the pier width)

40μm (at the smallest side)

<5mΩ-cm

300-525μm

TSV Wafer-Part Number-TSV Wafer Wafer diameter 150mm

TSV Wafer Wafer diameter 150mm

Available upon quote

By oxide liner (addiction by design)

0.2-2μm

90μm (3 times the pier width)

40μm (at the smallest side)

<5mΩ-cm

300-525μm

Click on the part number for more information about each product

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About Company Handling This Product

Icemos Technology Japan Co., Ltd.

  • Japan

Related search keywords

Silicon Wafers
Silicon Wafers　Icemos Technology Japan Co., Ltd.
Icemos Technology Japan Co., Ltd.

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