TSV Wafer
Icemos Technology Japan Co., Ltd.
About This Product
The development of innovative and powerful internal wafer conduction technology provides a means to solve design-related packaging issues such as IC and MEMS.
Internal conduction solutions facilitate design and wafer-level packaging including solder bump contacts. We apply a process to the board in advance and deliver it with conductive parts formed within the board. Ideal for foundations such as CMOS. The internal conduction points are filled with doped polysilicon by etching the wafer.
The wafer maintains surface metal contamination standards and flatness, and particles are of a grade that meets industry standards. Stable substrate performance has been confirmed even when exposed to a 1200℃ diffusion process.
We will partner with you to develop an internal conduction solution that meets your specifications and create the desired internal conduction pattern for your circuit or sensor. There will be bonding pads on the sides and bottom, but the design will be optimized and customized to meet your requirements.
■Application
・SOI solution for MEMS/MST
・Microfluidics/flow sensor
・RF MEMS
・Optoelectronics
・Smart power
・Advanced analog ICs
■Final market
・Telecommunications
·medical care
·car
・For general consumers
·musical instrument
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Product
TSV Wafer
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Handling Company
Icemos Technology Japan Co., Ltd.
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Categories
2 Models of TSV Wafer
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | Isolation resistance value | Maximum diameter | Minimum pitch | Oxide film thickness | Poly resistivity | Wafer thickness |
|---|---|---|---|---|---|---|---|---|
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TSV Wafer Wafer diameter 100mm |
Available upon quote | By oxide liner (addiction by design) | 40μm (at the smallest side) | 90μm (3 times the pier width) | 0.2-2μm | <5mΩ-cm | 300-525μm |
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TSV Wafer Wafer diameter 150mm |
Available upon quote | By oxide liner (addiction by design) | 40μm (at the smallest side) | 90μm (3 times the pier width) | 0.2-2μm | <5mΩ-cm | 300-525μm |
Click on the part number for more information about each product
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