IH reflow system WIS Series
Wonder Future Corporation Co., Ltd.
About This Product
■Semi-automatic double head specification
Damage-free mounting on non-heat resistant materials using electromagnetic induction (IH).
■Features
・Only the metal parts are heated using IH (electromagnetic induction principle). (Multi-stage heating possible)
・Equipped with heads for both FPCB bonding and component bonding.
- Enables soldering on non-heat resistant materials. PET, PBT, cloth, 3D MIDI, etc.
・ACF alternative: No need to apply pressure
・Laser replacement: No solder scattering, no sudden temperature rise
- Also effective for high heat dissipation substrates such as glass and power supply boards
・Ordinary solder can be used
・Soldering on 3D shapes and curved surfaces is also possible
・It can also be applied to thermosetting resins other than solder.
・Realizes energy and space savings.
■Application
・Resin touch panel
・RF-ID
・3D-MID
・Wearable
・LCD backlight
・Rework
■Implementation example
・Joining FPCB with resin touch panel. Compatible with 3D and curved surfaces
・Soldering parts such as LEDs on PET, cloth, and paper
・3D MID
■Work size (reference)
・FPCB:50×50mm
・Electronic parts: 1,005 chips
■Heatable circuit (reference)
・Mouth shape: min.□0.3×0.3mm
・Circuit width: min.W=0.3mm
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Product
IH reflow system WIS Series
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Handling Company
Wonder Future Corporation Co., Ltd.
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Categories
1 Models of IH reflow system WIS Series
| Product Image | Part Number | Price (excluding tax) | Body outline | Body weight | Head specifications | Heating method | Heating range | Induction heating power supply |
|---|---|---|---|---|---|---|---|---|
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WIS Series |
Available upon quote | W800×D900×H1,500mm | 600kg | 2 heads | 10 step heating | W4×1.50mm/W10×1.25mm | 2.8kw/3.5kw |
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