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  2. IH Reflow Repair Solution (Wonder Future Corporation Co., Ltd.)
IH Reflow Repair Solution-WIM-RUL01W
IH Reflow Repair Solution-Wonder Future Corporation Co., Ltd.

IH Reflow Repair Solution
Wonder Future Corporation Co., Ltd.

About This Product

■Unprecedented repair solution

・Supports repair of 0201 devices ・Repair is possible on high heat dissipation boards ・Repair device recovery possible - Possible to repair without damage to the base ・Equipment can be customized depending on the repair target

■Damageless component mounting technology on low heat resistant substrates

"IH reflow" is a mounting technology that applies IH (electromagnetic induction), and is a technology that allows only the parts that need to be mounted to be mounted instantly and without any physical stress or damage. This technology makes it possible to mount electronic components on low heat-resistant substrates such as inexpensive, flexible and stretchable PETIT, cloth, and paper. It also facilitates solder mounting on high heat dissipation substrates such as glass and power supply boards.

■Technical confirmation/simulation support

・Inexpensive IH reflow basic technology demonstration device also available - We can also perform simulations by receiving the customer's base and device information to be repaired. (charged)

  • Product

    IH Reflow Repair Solution

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1 Models of IH Reflow Repair Solution

Image Part Number Price (excluding tax) Induction heating power supply Body weight Body outline Heating method Work size Repair speed Size of parts to be repaired Stage size
IH Reflow Repair Solution-Part Number-WIM-RUL01W

WIM-RUL01W

Available upon quote

900kHz, 3.5kVA, AC200, 20A

1,600kg

W2,030×D1,350×H1,960 (mm)

10 step step cure

380mm×380mm (can be customized)

2~3sec/Device (varies depending on device size and board heat dissipation performance)

Minimum 0201 size (200μm×100μm)

400mm×400mm (can be customized)

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About Company Handling This Product

Wonder Future Corporation Co., Ltd.

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