Measuring device for ultra-high temperature thermal expansion coefficient measuring device
Mori Engineering Co., Ltd.

About This Product

■Thermal expansion can be measured at a furnace temperature of 2,500 degrees・Multiple samples can be measured simultaneously using image processing using a camera.
・High precision measurement possible with CCD 2 million pixels

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There is 1 model available for this product.

Product
Measuring device for ultra-high temperature thermal expansion coefficient measuring device

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Mori Engineering Co., Ltd.

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1 Models of Measuring device for ultra-high temperature thermal expansion coefficient measuring device

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About Company Handling This Product

Mori Engineering Co., Ltd.

Japan

Measuring device for ultra-high temperature thermal expansion coefficient measuring device Mori Engineering Co., Ltd.

About This Product

■Thermal expansion can be measured at a furnace temperature of 2,500 degrees

1 Models of Measuring device for ultra-high temperature thermal expansion coefficient measuring device