Liquid epoxy encapsulant for semiconductors-Liquid molding compound (LMC)

Liquid epoxy encapsulant for semiconductors-Underfill agent (CUF: Capillary Under Fill)

Liquid epoxy encapsulant for semiconductors-Pre-installed underfill agent (NCP: Non-Conductive Paste)

Liquid epoxy encapsulant for semiconductors-Nagase ChemteX Co., Ltd.

Liquid epoxy encapsulant for semiconductors
Nagase ChemteX Co., Ltd.

About This Product

We have a lineup of products that have excellent reliability in terms of solder reflow resistance, heat resistance, moisture resistance, etc., and are ideal for various construction methods such as compression molding, underfill, and pressure welding.

Model
There are 3 models available for this product.

Product
Liquid epoxy encapsulant for semiconductors

Handling Company
Nagase ChemteX Co., Ltd.

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Last viewed: 12 hours ago

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3 Models of Liquid epoxy encapsulant for semiconductors

Click on the part number for more information about each product

Image	Part Number	Price (excluding tax)
	Liquid molding compound (LMC)	Available upon quote
	Underfill agent (CUF: Capillary Under Fill)	Available upon quote
	Pre-installed underfill agent (NCP: Non-Conductive Paste)	Available upon quote

Click on the part number for more information about each product

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About Company Handling This Product

Nagase ChemteX Co., Ltd.

Japan

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