COM-HPC Server Size D Module with Intel® Xeon® D-2700 Series: CONGA-HPC/SILH-Conga-QA7: Qseven with Intel Atom x6000E series (Elkhart Lake)
COM-HPC Server Size D Module with Intel® Xeon® D-2700 Series: CONGA-HPC/SILH-Conga-QMX8-Plus: Qseven with NXP i.MX 8M Plus
COM-HPC Server Size D Module with Intel® Xeon® D-2700 Series: CONGA-HPC/SILH-Conga-QEVAL/Qseven 2.0: Evaluation carrier board for Qseven 2.0
COM-HPC Server Size D Module with Intel® Xeon® D-2700 Series: CONGA-HPC/SILH-congatec Japan K.K.

COM-HPC Server Size D Module with Intel® Xeon® D-2700 Series: CONGA-HPC/SILH
congatec Japan K.K.

💻 Electronics & Electrical Use 🚗 Automotive & Transport Use 🏥 Medical Industry Use

About This Product

CONGA-HPC/Silh is a Com-HPC Server Size D (160X160mm) module equipped with the Intel® Xeon® D-2700 series processor (the previous code name is ICE LAKE D). The processor can be selected from 5 types (4 to 20 cores), and the four DIMM sockets can implement up to 512GB of high -speed DDR4 memory (maximum 2933MT/s, ECC). 32X PCIE GEN 4 and 16X PCIE GEN 3 and 100 GBE throughput, 2.5 GBIT/S Ethernet, which supports TSN and TCC, with a processor base power consumption of 65 to 118 watts. A comprehensive board support package is provided to all major RTOS, including high -vizes supported by Real Time Systems, Linux, Windows, and VXWorks. ・ Form Factor: Com-HPC Server Size D (Size E option) ・ Processor: Intel® Xeon® D-2700 Series (previous code name is ICE LAKE D) ・ Memory: 4X DIMM socket, DDR4 (maximum 2933MT/s, ECC), up to 512GB* (* size e option is 8 sockets, up to 1TB) ·interface: -1x 2.5GBE TSN Ethernet, 2x 40g/4X 25g/8x 10g/2.5g/100m lane -32X PCIe Gen4, 16X PCIE GEN3 -4X USB 3.0, 4X USB 2.0 -2x Sata III (6GB/s), 2X UART, 12X GPIOS ・ Operation temperature range: Commercial: 0 to +60 ° C, Industrial: -40 to +85 ℃ ・ Size: 160 x 160 mm (size e option: 200 x 160mm) Congatec is a rapidly growing technology company that focuses on built -in, edge computing products and services. High -performance computer modules are used for industrial automation, medical technology, transportation, telecommunications, and many other areas of applications and devices.

  • Product

    COM-HPC Server Size D Module with Intel® Xeon® D-2700 Series: CONGA-HPC/SILH
  • Usage Scenarios

    Electronics & Electrical Use / Automotive & Transport Use / Medical Industry Use

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3 Models of COM-HPC Server Size D Module with Intel® Xeon® D-2700 Series: CONGA-HPC/SILH

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Product Image Part Number Price (excluding tax) Memory Number of cores Operating temperature range Processor Size Type
COM-HPC Server Size D Module with Intel® Xeon® D-2700 Series: CONGA-HPC/SILH-Part Number-Conga-QA7: Qseven with Intel Atom x6000E series (Elkhart Lake)

Conga-QA7: Qseven with Intel Atom x6000E series (Elkhart Lake)

Available upon quote Up to 16GB LPDDR4X (up to 4,267MT/s) (direct mounting) Up to 4 cores Commercial temperature range: 0°C to +60°C Industrial temperature range: -40°C to +85°C Intel Atom® x6000E Series (Elkhart Lake) 70x70mm Qseven
COM-HPC Server Size D Module with Intel® Xeon® D-2700 Series: CONGA-HPC/SILH-Part Number-Conga-QMX8-Plus: Qseven with NXP i.MX 8M Plus

Conga-QMX8-Plus: Qseven with NXP i.MX 8M Plus

Available upon quote Up to 6GB LPDDR4 (up to 4,000MT/s) (direct mounting) Arm Cortex-A53 x4 + Arm Cortex-M7 x1 + NPU Commercial temperature range: 0°C to +60°C Industrial temperature range: -40°C to +85°C NXP i.MX 8M Plus 70x70mm Qseven
COM-HPC Server Size D Module with Intel® Xeon® D-2700 Series: CONGA-HPC/SILH-Part Number-Conga-QEVAL/Qseven 2.0: Evaluation carrier board for Qseven 2.0

Conga-QEVAL/Qseven 2.0: Evaluation carrier board for Qseven 2.0

Available upon quote N/A N/A Commercial temperature range: 0°C to +60°C N/A 294 x 172mm Evaluation carrier board

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