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Silicon wafer batch automatic cleaning equipment-SCC-250
Silicon wafer batch automatic cleaning equipment-PHT Co., Ltd.

Silicon wafer batch automatic cleaning equipment
PHT Co., Ltd.


About This Product

Semiconductor cleaning equipment is a general term for equipment used in the cleaning process, which is one of the semiconductor manufacturing processes. The cleaning process is an important process that accounts for 30-40% of the entire semiconductor manufacturing process. There is cleaning as a pre-process to thoroughly remove dirt before the high-temperature treatment process or thin film formation process, and cleaning as a post-process to remove resist residue after the etching process to remove oxide and thin films. Semiconductor cleaning equipment is broadly divided into wet cleaning equipment that uses chemicals and pure water, and dry cleaning equipment that does not use chemicals. Semiconductor cleaning equipment is used in various processes in semiconductor manufacturing plants. It is used both in the pre-process to form semiconductor devices on silicon wafers and in the post-process to separate the devices and package them to manufacture final products. Particularly in the front-end process, contaminants and deposits on the wafer surface have a significant impact on semiconductor quality and yield. For this reason, semiconductor cleaning equipment is used at numerous stages, including before the process of forming oxide films and thin films on wafers, after the film formation process, and after the etching process.

■Corresponding process

Compatible with cleaning after wire sawing, cleaning after lapping, alkaline etching cleaning, cleaning before heat treatment, cleaning after heat treatment, cleaning after polishing, and FINAL cleaning.

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    Silicon wafer batch automatic cleaning equipment

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1 Models of Silicon wafer batch automatic cleaning equipment

Image Part Number Price (excluding tax) HEPA or ULPA LD&ULD Wafer size Wafer material Optional equipment Rinse tank Robot Drying Processing time Number of sheets processed Treatment tank and configuration Conveyance method Cleaning method Utility Chemical solution Chemical tank Chemical temperature
Silicon wafer batch automatic cleaning equipment-Part Number-SCC-250

SCC-250

Available upon quote

Quantity determined by configuration

Ionizer (optional)

Φ200mm・φ300mm

Silicon (compound semiconductors such as SiC require separate specifications meeting)

Ozone generator

Bubbling, QDR, resistivity meter installation

Made by PHT or PHOENIX ENGINEERING: Vertical axis (AC servo drive) + Travel axis (AC servo drive) + Chuck mechanism (air drive)

Hot water pulling, IR, spin dryer, marangony

1 batch (25 or 50 sheets) takes 5 minutes (300sec) ~6 minutes (360sec).

2 types: 25 sheets and 50 sheets

Separate specifications meeting depending on line configuration

Choose from carrier type or carrierless type

The configuration of the cleaning tank is determined by the process used.

Pure water, nitrogen (for air sensor), clean air, power supply, vacuum (for transportation)

O₃・HF・NCW・KOH・NH₄OH・H₂O₂・HCL・EDTA・HCL・Citric acid・DIW

Pendulum swing/rotation/ultrasonic

Can handle up to 100℃

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